IP Library › Patent Application 62814776
Patent Application Provisional
App. No. 62/814,776 · Confirmation No. 8528

METHODS FOR FABRICATING PRINTED CIRCUIT BOARD ASSEMBLIES WITH HIGH DENSITY VIA ARRAY

Provisional Application Expired
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 Code Description Pages PDF
2019-09-13 APP.FILE.REC Filing Receipt 3 View
2019-09-13 R48.REQ.G Acceptance of Request under Rule 48 to correct inventorship or name 1 View
2019-09-11 R48.REQ Request under Rule 48 correcting inventorship 1 View
2019-09-11 TR.PROV Provisional Cover Sheet (SB16) 4 View
2019-09-11 WFEE Fee Worksheet (SB06) 2 View
2019-09-11 N417 Electronic Filing System Acknowledgment Receipt 2 View
2019-03-15 APP.FILE.REC Filing Receipt 3 View
2019-03-06 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
2019-03-06 TR.PROV Provisional Cover Sheet (SB16) 3 View
2019-03-06 SPEC Specification 12 View
2019-03-06 CLM Claims 3 View
2019-03-06 ABST Abstract 1 View
2019-03-06 DRW.NONBW Drawings-other than black and white line drawings 8 View
2019-03-06 WFEE Fee Worksheet (SB06) 2 View
2019-03-06 N417 Electronic Filing System Acknowledgment Receipt 3 View
2019-03-06 DRW.SUPP Drawings-black and white line and/or other drawings — View
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Quick Facts
App. No.
62/814,776
Filed
2019-03-06