Methods for fabricating printed circuit board assemblies with high density via array
A method is provided for forming a printed circuit board (PCB) assembly. The method may include drilling a first plurality of vias having a first diameter in a PCB and filling the first plurality of vias to form a first plurality of plated or filled vias. The method may also include drilling a second plurality of vias having a second diameter in the PCB, and filling the second plurality of vias to form a second plurality of plated or filled vias. The first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.
1. A method for forming a printed circuit board (PCB) assembly, the method comprising:
drilling a first plurality of vias having a first diameter in a PCB;
filling the first plurality of vias to form a first plurality of plated or filled vias;
drilling a second plurality of vias having a second diameter in the PCB;
filling the second plurality of vias to form a second plurality of plated or filled vias;
drilling a third plurality of vias having a third diameter in the PCB between the first plurality and second plurality of vias; and
filling the third plurality of vias to form a third plurality of plated or filled vias, wherein the first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.
2. The method of claim 1 , further comprising planarizing the first plurality of plated or filled vias and/or the second plurality of plated or filled vias.
3. The method of claim 1 , further comprising planarizing the third plurality of plated or filled vias.
4. The method of claim 1 , wherein the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter, the second diameter, and the third diameter.
5. The method of claim 1 , wherein each of the first plurality of plated or filled vias is surrounded by two or more of the second plurality of plated or filled vias and two or more of the third plurality of plated or filled vias.
6. The method of claim 1 , further comprising routing one or more exterior or exposed traces in the PCB through the first plurality and the second plurality of plated or filled vias to shorten lengths for one or more wire bonds or SMT connections.
7. The method of claim 1 , further comprising placing one or more buried traces underneath one or more of surface mount technology (SMT) components.
8. The method of claim 1 , further comprising placing one or more conductive pads underneath one or more of surface mount technology (SMT) components.
9. The method of claim 1 , wherein each of the first plurality of vias and the second plurality of vias comprise through via, blind vias, and/or buried vias.
10. The method of claim 1 , further comprising varying the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias to adjust a coefficient of thermal expansion (CTE) of the PCB.
11. The method of claim 1 , the step of filling the first plurality of vias to form a first plurality of plated or filled vias comprises plating copper to fill the first plurality of vias in the outer layer or filling the first plurality of vias with a filling material in the layers of the PCB below the outer layer.
12. The method of claim 1 , wherein a first filling material fills the first plurality of vias, and a second filling material fills the second plurality of vias.
13. The method of claim 12 , wherein the first filling material is different from the second filling material to adjust a coefficient of thermal expansion (CTE) of the PCB.
14. The method of claim 12 , wherein each of the first filling material in the first plurality of plated or filled vias and the second filling material in the second plurality of plated or filled vias has a thermal conductivity ranging from 0.01 W/mK to 1400 W/mK.
15. The method of claim 12 , wherein the first filling material or second filling material is selected from a group consisting of copper, solder, gold, silver, aluminum, and thermally conductive materials.
16. The method of claim 12 , wherein the first filling material or the second filling material comprises one or more of conductive paste, plated solid copper, powder metal, micro metal particles, or nano metal particles.
17. The method of claim 12 , wherein the first filling material or second filling material comprises a non-conductive material.
18. The method of claim 17 , wherein the non-conductive materials comprise epoxy or polyimide.
19. The method of claim 1 , wherein each of the first plurality of plated or filled vias is surrounded by two or more of the second plurality of plated or filled vias.
20. The method of claim 1 , wherein the first plurality of plated or filled vias and the second plurality of plated or filled vias are underneath SMT components and/or around the SMT components.
21. The method of claim 1 , further comprising forming one or more plated or filled vias at discrete locations.
22. A method for forming a printed circuit board (PCB) assembly, the method comprising:
drilling a first plurality of vias having a first diameter in a PCB;
filling the first plurality of vias to form a first plurality of plated or filled vias;
drilling a second plurality of vias having a second diameter in the PCB;
filling the second plurality of vias to form a second plurality of plated or filled vias;
routing one or more exterior or exposed traces in the PCB through the first plurality and the second plurality of plated or filled vias to shorten lengths for one or more wire bonds or SMT connections; and,
wherein the first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.
23. A method for forming a printed circuit board (PCB) assembly, the method comprising:
drilling a first plurality of vias having a first diameter in a PCB;
filling the first plurality of vias to form a first plurality of plated or filled vias;
drilling a second plurality of vias having a second diameter in the PCB;
filling the second plurality of vias to form a second plurality of plated or filled vias;
varying the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias to adjust a coefficient of thermal expansion (CTE) of the PCB; and,
wherein the first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.
24. A method for forming a printed circuit board (PCB) assembly, the method comprising:
drilling a first plurality of vias having a first diameter in a PCB;
filling the first plurality of vias to form a first plurality of plated or filled vias;
drilling a second plurality of vias having a second diameter in the PCB;
filling the second plurality of vias to form a second plurality of plated or filled vias;
wherein a first filling material fills the first plurality of vias, and a second filling material fills the second plurality of vias;
wherein the first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.