Patent Assignment
Reel/Frame 049445/0380
Assignment of Assignor's Interest
Recorded: 2019-06-12
Pages: 9
Assignors
LEN, MICHAEL
Executed: 2019-06-06
MEI, CHONG
Executed: 2019-03-15
LUGERT, MICHAEL
Executed: 2019-06-10
KUMAR, RAJ
Executed: 2019-06-10
Assignee
TTM TECHNOLOGIES INC.
101 SOUTH HANLEY ROAD, SUITE 1800, ST. LOUIS, MISSOURI, 63105
Covered Properties
(2)
Methods for Fabricating Printed Circuit Board Assemblies with High Density via Array
Patent:
10,980,127 →
Application:
16/435,174 →
Publication:
US 2020/0288576
PCT:
PCT/US2019/036074 ↗
Methods for Fabricating Printed Circuit Board Assemblies with High Density via Array
Application:
62/814,776 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Corrective Assignment to Correct the Receiving Party Name Previously Recorded at Reel: 049445 Frame: 0380. Assignor(S) Hereby Confirms the Assignment.
May 23, 2023
From: LEN, MICHAEL; MEI, CHONG; LUGERT, MICHAEL; KUMAR, RAJ
To: TTM TECHNOLOGIES, INC.
Reel/Frame 064105/0546 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →