Patent Application
Provisional
App. No. 63/224,366
· Confirmation No. 6506
RESIN COMPOSITION FOR NON-CONDUCTIVE FILM WITH EXCELLENT HIGH TEMPERATURE PROPERTIES FOR 3D TSV PACKAGES
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2021-08-03 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2021-07-21 | SCORE |
Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) | 1 | View | |
| 2021-07-21 | ADS |
Application Data Sheet | 9 | View | |
| 2021-07-21 | DRW.NONBW |
Drawings-other than black and white line drawings | 6 | View | |
| 2021-07-21 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2021-07-21 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2021-07-21 | SPEC |
Specification | 47 | View | |
| 2021-07-21 | CLM |
Claims | 10 | View | |
| 2021-07-21 | ABST |
Abstract | 1 | View | |
| 2021-07-21 | DRW.SUPP |
Drawings-black and white line and/or other drawings | — | View |
Inventors
Jie Bai
Aliso Viejo, CANADA
Qizhuo Zhuo
Irvine, CA
James Sungwook Jang
Seoul, KOREA, REPUBLIC OF
Kyu Chang Shim
Irvine, CA
Attorneys & Agents of Record
Prosecution
- Customer No.
- 31217
- Docket No.
- 2020P00128 US
- Confirmation No.
- 6506
No recorded assignments were found for this patent.
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Quick Facts
- App. No.
- 63/224,366
- Filed
- 2021-07-21
External Links