Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.
1. A processor module comprising:
at least a first integrated circuit die element including a programmable array;
at least a second integrated circuit die element stacked with and electrically coupled to said programmable array of said first integrated circuit die element; and
wherein said first and second integrated circuit die elements are electrically coupled by a number of contact points distributed throughout the surfaces of said die elements, and wherein said contact points traverse said die elements through a thickness thereof.
2. The processor module of claim 1 wherein said programmable array of said first integrated circuit die element comprises an FPGA.
3. The processor module of claim 1 wherein said processor of said second integrated circuit die element comprises a microprocessor.
4. The processor module of claim 1 wherein said second integrated circuit die element comprises a memory.
5. The processor module of claim 1 further comprising:
at least a third integrated circuit die element stacked with and electrically coupled to at least one of said first or second integrated circuit die elements.
6. The processor module of claim 5 wherein said third integrated circuit die element comprises a memory.
7. The processor module of claim 1 wherein said programmable array is reconfigurable as a processing element.
8. The processor module of claim 1 wherein said die elements are thinned to a point at which said contact points traverse said thickness of said die elements.
9. A reconfigurable computer system comprising:
a processor;
a memory;
at least one processor module including at least a first integrated circuit die element having a programmable a array and at least a second integrated circuit die element stacked with and electrically coupled to said programmable array of said first integrated circuit die element; and
wherein said first and second integrated circuit die elements are electrically coupled by a number of contact points distributed throughout the surfaces of said die elements, and wherein said contact points traverse said die elements through a thickness thereof.
10. The computer system of claim 9 wherein said programmable array of said first integrated circuit die element comprises an FPGA.
11. The computer system of claim 9 , wherein said processor of said second integrated circuit die element comprises a microprocessor.
12. The computer system of claim 9 wherein said second integrated circuit die element comprises a memory.
13. The computer system of claim 9 further comprising:
at least a third integrated circuit die element stacked with and electrically coupled to at least one of said first or second integrated circuit die elements.
14. The computer system of claim 13 wherein said third integrated circuit die element comprises a memory.
15. The computer system of claim 9 wherein said programmable array is reconfigurable as a processing element.
16. The computer system of claim 9 wherein said die elements are thinned to a point at which said contact points traverse said thickness of said die elements.
17. A processor module comprising:
at least a first integrated circuit die element including a programmable array;
at least a second integrated circuit die element including a processor stacked with and electrically coupled to said programmable array of said first integrated circuit die element;
at least a third integrated circuit die element including a memory stacked with and electrically coupled to said programmable array and said processor of said first and second integrated circuit die elements respectively; and
wherein said first, second and third integrated circuit die elements are electrically coupled by a number of contact points distributed throughout the surfaces of said die elements, and wherein said contact points traverse said die elements through a thickness thereof.
18. The processor module of claim 17 wherein said programmable array of said first integrated circuit die element comprises an FPGA.
19. The processor module of claim 17 wherein said processor of said second integrated circuit die element comprises a microprocessor.
20. The processor module of claim 17 wherein said memory of said third integrated circuit die element comprises a memory array.
21. The processor module of claim 17 wherein said programmable array is reconfigurable as a processing element.
22. The processor module of claim 17 wherein said die elements are thinned to a point at which said contact points traverse said thickness of said die elements.
23. A programmable array module comprising:
at least a first integrated circuit die element including a field programmable gate array;
at least a second integrated circuit die element including a memory array stacked with and electrically coupled to said field programmable gate array of said first integrated circuit die element; and
wherein said field programmable gate array is programmable as a processing element, and wherein said memory array is functional to accelerate external memory references to said processing element.
24. The programmable array module of claim 23 wherein said memory array is functional to accelerate reconfiguration of said field programmable gate array as a processing element.
25. A reconfigurable processor module comprising:
at least a first integrated circuit die element including a programmable array;
at least a second integrated circuit die element including a processor stacked with and electrically coupled to said programmable array of said first integrated circuit die element; and
at least a third integrated circuit die element including a memory stacked with and electrically coupled to said programmable array and said processor of said first and second integrated circuit die elements respectively
whereby said processor and said programmable array are operational to share data therebetween.
26. The reconfigurable processor module of claim 25 wherein said memory is operational to at least temporarily store said data.
27. The reconfigurable processor module of claim 25 wherein said programmable array of said first integrated circuit die element comprises an FPGA.
28. The reconfigurable processor module of claim 25 wherein said processor of said second integrated circuit die element comprises a microprocessor.
29. The reconfigurable processor module of claim 25 wherein said memory of said third integrated circuit die element comprises a memory array.
30. A programmable array module comprising:
at least a first integrated circuit die element including a field programmable gate array;
at least a second integrated circuit die element including a memory array stacked with and electrically coupled to said field programmable gate array of said first integrated circuit die element, said first and second integrated circuit die elements being coupled by a number of contact points distributed throughout the surfaces of said die elements; and
wherein said field programmable gate array is programmable as a processing element, and wherein said memory array is functional to accelerate reconfiguration of said field programmable gate array as a processing element.
31. A programmable array module comprising:
at least a first integrated circuit die element including a field programmable gate array; and
at least a second integrated circuit die element including a memory array stacked with and electrically coupled to said field programmable gate array of said first integrated circuit die element,
wherein said field programmable gate array is programmable as a processing element, and wherein said memory array is functional as block memory for said processing element.
32. The programmable array module of claim 31 wherein said memory array is functional to accelerate reconfiguration of said field programmable gate array as a processing element.
33. A programmable array module comprising:
at least a first integrated circuit die element including a field programmable gate array; and
at least a second integrated circuit die element including a memory array stacked with and electrically coupled to said field programmable gate array of said first integrated circuit die element, said first and second integrated circuit die elements being coupled by a number of contact points distributed throughout the surfaces of said die elements,
wherein said field programmable gate array is programmable as a processing element and wherein said memory array is functional to accelerate external memory references to said processing element.
34. A programmable array module comprising:
at least a first integrated circuit die element including a field programmable gate array; and
at least a second integrated circuit die element including a memory array stacked with and electrically coupled to said field programmable gate array of said first integrated circuit die element, said first and second integrated circuit die elements being coupled by a number of contact points distributed throughout the surfaces of said die elements,
wherein said field programmable gate array is programmable as a processing element and wherein said memory array is functional as block memory for said processing element.
35. A programmable array module comprising:
at least a first integrated circuit die element including a field programmable gate array; and
at least a second integrated circuit die element including a memory array stacked with and electrically coupled to said field programmable gate array of said first integrated circuit die element, said first and second integrated circuit die elements being coupled by a number of contact points distributed throughout the surfaces of said die elements,
wherein said contact points are further functional to provide test stimulus from said field programmable gate array to said at least second integrated circuit die element.
36. A programmable array module comprising:
at least a first integrated circuit die element including a field programmable gate array;
at least a second integrated circuit die element including a memory array stacked with and electrically coupled to said field programmable gate array of said first integrated circuit die element, said first and second integrated circuit die elements being coupled by a number of contact points distributed throughout the surfaces of said die elements; and
at least a third integrated circuit die element stacked with and electrically coupled to at least one of said first or second integrated circuit die elements.
37. The programmable array module of claim 36 wherein said third integrated circuit die element includes another field programmable gate array.
38. The programmable array module of claim 36 wherein said third integrated circuit die element includes an I/O controller.