Patent Assignment
Reel/Frame 050641/0207
Assignment of Assignor's Interest
Recorded: 2019-10-07
Pages: 5
Assignor
ARBOR COMPANY LLLP
Executed: 2019-09-26
Assignee
ARBOR GLOBAL STRATEGIES, LLC
P.O. BOX 128, GLENBROOK, NEVADA, 89413
Covered Properties
(5)
Reconfigurable Processor Module Comprising Hybrid Stacked Integrated Circuit Die Elements
Reconfigurable Processor Module Comprising Hybrid Stacked Integrated Circuit Die Elements
Reconfigurable Processor Module Comprising Hybrid Stacked Integrated Circuit Die Elements
Reconfigurable Processor Module Comprising Hybrid Stacked Integrated Circuit Die Elements
Reconfigurable Processor Module Comprising Hybrid Stacked Integrated Circuit Die Elements
Patent:
42,035 →
Application:
12/178,511 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 8, 2002
From: HUPPENTHAL, JON M.; GUZY, D. JAMES
To: ARBOR COMPANY LLP
Reel/Frame 012690/0534 →
Assignment of Assignor's Interest
Mar 16, 2004
From: HUPPENTHAL, JON M.; GUZY, D. JAMES
To: ARBOR COMPANY LLP
Reel/Frame 015118/0593 →
Lien
Dec 31, 2008
From: GUZY, D. JAMES; ARBOR COMPANY, LLP A/K/A ARBOR COMPANY, LLLP
To: GUZY, MARY ANN
Reel/Frame 022043/0095 →
Security Agreement
Feb 27, 2009
From: ARBOR COMPANY, LLLP
To: GUZY, MARY ANN; GUZY, MARK
Reel/Frame 022320/0200 →
Assignment of Assignor's Interest
Nov 18, 2019
From: ARBOR COMPANY LLLP
To: ARBOR GLOBAL STRATEGIES, LLC
Reel/Frame 051032/0115 →