Patent Assignment
Reel/Frame 022320/0200
Security Agreement
Recorded: 2009-02-27
Pages: 12
Assignor
ARBOR COMPANY, LLLP
Executed: 2009-02-23
Assignees
GUZY, MARY ANN
C/O MORRISON, BROWN, ARGIZ & FARRA, LLP, 1001 BRICKELL BAY DRIVE, 9TH FLOOR, MIAMI, FLORIDA, 33131
GUZY, MARK
2565 STETSON CIRCLE, MINDEN, NEVADA, 89423
Covered Properties
(5)
Reconfigurable Processor Module Comprising Hybrid Stacked Integrated Circuit Die Elements
Reconfigurable Processor Module Comprising Hybrid Stacked Integrated Circuit Die Elements
Reconfigurable Processor Module Comprising Hybrid Stacked Integrated Circuit Die Elements
Logic device comprising reconfigurable core logic for use in conjunction with microprocessor-based computer systems
Application:
10/992,871 →
Publication:
US 2006/0136606
Reconfigurable Processor Module Comprising Hybrid Stacked Integrated Circuit Die Elements
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 8, 2002
From: HUPPENTHAL, JON M.; GUZY, D. JAMES
To: ARBOR COMPANY LLP
Reel/Frame 012690/0534 →
Assignment of Assignor's Interest
Mar 16, 2004
From: HUPPENTHAL, JON M.; GUZY, D. JAMES
To: ARBOR COMPANY LLP
Reel/Frame 015118/0593 →
Assignment of Assignor's Interest
Feb 7, 2005
From: GUZY, D. JAMES; BURTON, LEE; HUPPENTHAL, JON M.
To: ARBOR COMPANY LLP
Reel/Frame 016243/0346 →
Lien
Dec 31, 2008
From: GUZY, D. JAMES; ARBOR COMPANY, LLP A/K/A ARBOR COMPANY, LLLP
To: GUZY, MARY ANN
Reel/Frame 022043/0095 →
Assignment of Assignor's Interest
Oct 7, 2019
From: ARBOR COMPANY LLLP
To: ARBOR GLOBAL STRATEGIES, LLC
Reel/Frame 050641/0207 →
Assignment of Assignor's Interest
Nov 18, 2019
From: ARBOR COMPANY LLLP
To: ARBOR GLOBAL STRATEGIES, LLC
Reel/Frame 051032/0115 →