IP Library › Assignment 015118/0593
Patent Assignment
Reel/Frame 015118/0593

Assignment of Assignor's Interest

Recorded: 2004-03-16 Pages: 4
Assignors
HUPPENTHAL, JON M.
Executed: 2004-02-26
GUZY, D. JAMES
Executed: 2004-03-11
Assignee
ARBOR COMPANY LLP
223 SOUTH MEADOW, GLENBROOK, NEVADA, 89413
Covered Property (1)
Reconfigurable Processor Module Comprising Hybrid Stacked Integrated Circuit Die Elements
Patent: 7,126,214 →
Application: 10/802,067 →
Publication: US 2004/0177237
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Lien Dec 31, 2008
From: GUZY, D. JAMES; ARBOR COMPANY, LLP A/K/A ARBOR COMPANY, LLLP
To: GUZY, MARY ANN
Reel/Frame 022043/0095 →
Security Agreement Feb 27, 2009
From: ARBOR COMPANY, LLLP
To: GUZY, MARY ANN; GUZY, MARK
Reel/Frame 022320/0200 →
Assignment of Assignor's Interest Oct 7, 2019
From: ARBOR COMPANY LLLP
To: ARBOR GLOBAL STRATEGIES, LLC
Reel/Frame 050641/0207 →
Assignment of Assignor's Interest Nov 18, 2019
From: ARBOR COMPANY LLLP
To: ARBOR GLOBAL STRATEGIES, LLC
Reel/Frame 051032/0115 →