Granted Patent
S1
US 656,906 · App. 29/380,636 · Granted Apr 3, 2012
LED package
Assignee:
Cree Hong Kong Limited
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Claims (1)
The ornamental design for an LED package, as shown and described.
Assignments (3)
PATENT SECURITY AGREEMENT
Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Jul 27, 2021
From: CREE HONG KONG LIMITED
To: CREELED, INC.
Reel/Frame 056990/0571 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Feb 23, 2021
From: LEUNG, CHI-WING
To: CREE HONG KONG LIMITED
Reel/Frame 055375/0724 →
Continuity (1)
Division
29294459
· Jan 10, 2008