Granted Patent
S1
US 662,902 · App. 29/377,708 · Granted Jul 3, 2012
LED package
Assignee:
Cree Hong Kong Limited
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Claims (1)
The ornamental design for LED package, as shown and described.
Assignments (3)
PATENT SECURITY AGREEMENT
Recorded Jun 30, 2025
From: CREELED, INC.; PENGUIN SOLUTIONS CORPORATION (DE); SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; SMART MODULAR TECHNOLOGIES, INC.; PENGUIN COMPUTING, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 071755/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Jul 27, 2021
From: CREE HONG KONG LIMITED
To: CREELED, INC.
Reel/Frame 056990/0571 →
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Feb 23, 2021
From: SHIEH, YUH-REN; LEUNG, CHI-WING
To: CREE HONG KONG LIMITED
Reel/Frame 055372/0097 →
Continuity (1)
Division
29293900
· Dec 14, 2007