Hybrid optical element and photodetector device
The present invention concerns a hybrid optical element including at least one optical element ( 2 ) attached to one surface of a substrate ( 1 ), a semiconductor laser ( 3 ) and a photodetector ( 4 ) attached to the other surface of the substrate ( 1 ) and an intermediate member (relay substrate) ( 5 ) interposed between the substrate ( 1 ) and the photodetector ( 4 ). The intermediate member ( 5 ) has a through hole ( 6 ) through which a light flux incident on the photodetector ( 4 ) is allowed to pass and a part with a conductivity by which a terminals of the photodetector ( 4 ) are connected to a conductor pattern on the substrate ( 1 ).
1. A hybrid optical element comprising:
a substrate;
at least one optical element attached to one surface of the substrate;
a light emitting element and a photodetector attached to the other surface of the substrate; and
an intermediate member interposed between the substrate and the photodetector; wherein the intermediate member is formed with a material having an absorption property in the wavelength of light emitted from the light emitting element and has a hole through which a light flux incident on the photodetector is allowed to pass, and a part with a conductivity by which a terminal of the photodetector is connected to a conductor pattern on the substrate.
2. The hybrid optical element according to claim 1 , wherein the intermediate member is composed of any one of materials such as alumina, aluminum nitride or glass epoxy.
3. The hybrid optical element according to claim 1 , wherein the intermediate material is composed of any of materials such as silicon, gallium-arsenic, indium-phosphorus or zinc selenide.
4. The hybrid optical element according to claim 1 , wherein the intermediate member is provided with electrode pads connected to the part with the conductivity, the photodetector is provided with electrode pads connected to terminals and the electrode pads of the intermediate member are bonded to the electrode pads of the photodetector by a flip chip bonding process under a state that a light receiving surface of the photodetector is directed toward the intermediate member.
5. A hybrid optical element comprising:
a substrate;
at least one optical element attached to one surface of the substrate;
a light emitting element and a photodetector attached to the other surface of the substrate; and
an intermediate member interposed between the substrate and the photodetector; wherein the intermediate member is formed with a transparent material having no absorption property in the wavelength of light emitted from the light emitting element and has a part with a conductivity by which a terminal of the photodetector is connected to a conductor pattern on the substrate.
6. The hybrid optical element according to claim 5 , wherein the intermediate member is composed of any one of materials such as sapphire, optical glass, a synthetic resin material, a group III nitride semiconductor, zinc oxide, and SiC.
7. The hybrid optical element according to claim 5 , wherein an AR coat film which does not reflect the light of wavelength emitted from the light emitting element is formed at least one surface of the intermediate member.
8. The hybrid optical element according to claim 5 , wherein the intermediate member is provided with electrode pads connected to the part having the conductivity, the photodetector is provided with electrode pads connected to terminals and the electrode pads of the intermediate member are bonded to the electrode pads of the photodetector by a flip chip bonding process under a state that a light receiving surface of the photodetector is directed toward the intermediate member.
9. The hybrid optical element according to claim 5 , wherein a part between the intermediate member and the photodetector is sealed by a sealing material.
10. A photodetector device comprising:
a substrate;
at least one optical element attached to one surface of the substrate;
a light emitting element and a photodetector attached to the other surface of the substrate; and
an intermediate member interposed between the substrate and the photodetector; wherein the intermediate member is formed with a transparent material having no absorption property in the wavelength of light emitted from the light emitting element and has a part with a conductivity by which a terminal of the photodetector is connected to a conductor pattern on the substrate.
11. A method for manufacturing a hybrid optical element comprising the steps of:
attaching at least one optical element on one surface of a substrate having a conductor pattern;
attaching a light emitting element to the other surface of the substrate;
positioning and attaching a photodetector to an intermediate member having a hole through which a light flux incident on the photodetector is allowed to pass and a part with a conductivity and interposed between the substrate and the photodetector;
then, attaching the intermediate member to the other surface of the substrate; and
connecting a terminal of the photodetector to a conductor pattern on the substrate through the part with the conductivity of the intermediate member.
12. The method for manufacturing a hybrid optical element according to claim 11 , wherein the optical element is positioned and attached to the substrate by using as a reference a through hole formed on the substrate for allowing the light flux emitted from the light emitting element to pass.