IP Library Granted Patent US 6,853,046
Granted Patent B2
US 6,853,046 · App. 10/668,605 · Granted Feb 8, 2005

Photodiode array and method of making the same

Assignee: Hamamatsu Photonics, K.K.
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Quick Facts
Patent No.
US 6,853,046
App. No.
10/668,605
Granted
Feb 8, 2005
Kind
B2
Abstract

A photodiode array comprises a semiconductor substrate formed with an array of a plurality of pn junction type photodiodes on a light incident surface side, the surface opposite from the incident surface in the semiconductor substrate being made of a (100) plane; a through hole, formed in an area held between the photodiodes, penetrating through the semiconductor substrate from the incident surface side to the opposite surface side; and a conductive layer extending from the incident surface to the opposite surface by way of a wall surface of the through hole; the through hole being formed by connecting a vertical hole part formed substantially perpendicular to the incident surface on the incident surface side, and a pyramidal hole part formed like a quadrangular pyramid on the opposite surface side to each other within the semiconductor substrate; the pyramidal hole part having a wall surface formed as a (111) plane.

Claims (8)

1. A photodiode array comprising a semiconductor substrate of a first conduction type formed with an array of a plurality of pn junction type photodiodes on an incident surface side for light to be detected, the surface opposite from the incident surface in the semiconductor substrate being made of a (100) plane; the semiconductor substrate having a through hole, formed in an area held between the photodiodes, penetrating through the semiconductor substrate from the incident surface side to the opposite surface side;

the photodiode array comprising a conductive layer extending from the incident surface to the opposite surface by way of a wall surface of the through hole;

the through hole comprising:

a vertical hole part formed substantially perpendicular to the incident surface on the incident surface side, and

a pyramidal hole part formed like a quadrangular pyramid on the opposite surface side;

the vertical hole part and pyramidal hole part being connected to each other within the semiconductor substrate,

the pyramidal hole part having a wall surface formed as a (111) plane.

2. A photodiode array according to claim 1 , further comprising a high impurity concentration layer of the first conduction type surrounding the through hole within the semiconductor substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2004
From: SHIBAYAMA, KATSUMI
To: HAMAMATSU PHOTONICS K.K.
Reel/Frame 014997/0439 →
Priority Claims (1)
JP P2002-277948 · Sep 24, 2002 · national
Continuity (2)
Provisional Application 6043067400 · Dec 4, 2002
Related Publication 20040129992A1 · Jul 8, 2004