Multi-phase polishing pad
An article of manufacture, a method, and an apparatus for use in a chemical mechanical polishing system is provided. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a polishing surface, the polishing surface including a first polishing portion having a first polishing material of a first hardness for polishing a first portion of the substrate, and a second polishing portion having a second polishing material of a second hardness for polishing a second portion of the substrate. The article of manufacture may be disposed on a rotatable, stationary, or linear platen for processing a substrate. In another aspect, a method is provided for processing a substrate, including providing a platen containing the polishing article disposed on the rotatable platen, delivering a polishing composition to the polishing article, and contacting a substrate on the polishing article.
1. An article of manufacture for polishing a substrate, comprising:
a polishing article having a polishing surface, the polishing surface comprising:
a first polishing portion having a first polishing material of a first hardness adapted to polish a center portion of the substrate; and
a second polishing portion having a second polishing material of a second hardness adapted to polish an outer portion of the substrate, wherein the first hardness is greater than the second hardness and the first hardness is about 50 or higher on a Shore D hardness scale.
2. An apparatus for processing a substrate, comprising:
a rotatable, stationary, or linear platen; and
a polishing article having a polishing surface, the polishing surface comprising
a first polishing portion having a first polishing material of a first hardness adapted to polish a center portion of the substrate; and
a second polishing portion having a second polishing material of a second hardness adapted to polish an outer portion of the substrate, wherein the first hardness is greater than the second hardness and the first hardness is about 50 or higher on a Shore D hardness scale.
3. A method for processing a substrate, comprising:
providing a rotatable platen and polishing article disposed thereon, the polishing article having a polishing surface comprising a first polishing portion having a first polishing material of a first hardness adapted to polish a center portion of the substrate and a second polishing portion having a second polishing material of a second hardness adapted to polish an outer portion of the substrate, wherein the first hardness is greater than the second hardness; and
contacting the substrate on the polishing article, the center portion of the substrate contacting the first polishing material and the outer portion of the substrate contacting the second polishing material and the first hardness is about 50 or higher on a Shore D hardness scale.
4. An article of manufacture for polishing a substrate, comprising:
a polishing article having a polishing surface, the polishing surface comprising:
a first polishing portion having a first polishing material of a first hardness adapted to polish a center portion of the substrate; and
a second polishing portion having a second polishing material of a second hardness adapted to polish an outer portion of the substrate, wherein the first hardness is greater than the second hardness and the first polishing material has a specific gravity of about 0.6 or greater.
5. An apparatus for processing a substrate, comprising:
a rotatable, stationary, or linear platen; and
a polishing article having a polishing surface, the polishing surface comprising
a first polishing portion having a first polishing material of a first hardness adapted to polish a center portion of the substrate; and
a second polishing portion having a second polishing material of a second hardness adapted to polish an outer portion of the substrate, wherein the first hardness is greater than the second hardness and the first polishing material has a specific gravity of about 0.6 or greater.
6. A method for processing a substrate, comprising:
providing a rotatable platen and polishing article disposed thereon, the polishing article having a polishing surface comprising a first polishing portion having a first polishing material of a first hardness adapted to polish a center portion of the substrate and a second polishing portion having a second polishing material of a second hardness adapted to polish an outer portion of the substrate, wherein the first hardness is greater than the second hardness; and
contacting the substrate on the polishing article, the center portion of the substrate contacting the first polishing material and the outer portion of the substrate contacting the second polishing material, wherein the first polishing material has a specific gravity of about 0.6 or greater.