IP Library Granted Patent US 6,863,926
Granted Patent B2
US 6,863,926 · App. 10/346,029 · Granted Mar 8, 2005

Corrosive-resistant coating over aluminum substrates for use in plasma deposition and etch environments

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Quick Facts
Patent No.
US 6,863,926
App. No.
10/346,029
Granted
Mar 8, 2005
Kind
B2
Abstract

A method and apparatus are provided for protecting internal aluminum components of a plasma reactor from plasma-induced erosion. The components are coated, first with a dielectric layer, then with a thin layer of one or more metals selected from the group consisting of gold, chromium, platinum, silver and rhenium. The dielectric layer may either be grown or deposited. The metal layer is deposited, preferably using evaporative deposition.

Claims (24)

1. A method for creating a protective layer on aluminum components used in a plasma chambers, including the steps of:

coating the substrate with a dielectric layer, which is a composite of at least two different dielectric materials deposited simultaneously; and

coating the dielectric layer with a layer of metal selected from the group consisting of nickel, palladium, platinum, chromium, silver and rhenium.

2. The method of claim 1 , wherein said dielectric layer is deposited via chemical vapor deposition.

3. The method of claim 1 , wherein said dielectric layer is deposited via thermal spraying.

4. The method of claim 3 , wherein said dielectric layer is melted and deposited using a plasma gun.

5. The method of claim 1 , wherein said dielectric layer has a thickness within a range of about 0.0127 mm to 0.0762 mm.

6. The method of claim 1 , wherein said dielectric layer comprises a fluorocarbon polymer.

7. The method of claim 1 , wherein said dielectric layer contains at least one dielectric material selected from the group consisting of boron carbide, silicon carbide, silicon dioxide, silicon nitride, CVD diamond, aluminum silicates, and glass ceramics.

8. The method of claim 1 , wherein said metal layer has a thickness within a range of about 0.0508 mm to 0.0762 mm.

9. The method of claim 1 , wherein said metal layer is deposited using a process selected from the group consisting of chemical vapor deposition and evaporative techniques.

10. The method of claim 1 , wherein said metal layer is a composite of at least two different metals deposited simultaneously.

11. A method for creating a protective layer on aluminum components used in a plasma chambers, including the steps of:

coating the substrate with a dielectric layer; and

coating the dielectric layer with a metal layer, said metal layer bring a composite of at least two different metals, said two different metals being selected from the group consisting of nickel, palladium, platinum, chromium, silver and rhenium, and being deposited simultaneously using evaporative deposition.

12. The method of claim 11 , wherein said dielectric layer is deposited via chemical vapor deposition.

13. The method of claim 11 , wherein said dielectric layer is created via anodization.

14. The method of claim 11 , wherein said dielectric layer is deposited via thermal spraying.

15. The method of claim 14 , wherein said dielectric layer is melted and deposited using a plasma gun.

16. The method of claim 11 , wherein said dielectric layer has a thickness within a range of about 0.0127 mm to 0.0762 mm.

17. The method of claim 11 , wherein said dielectric layer is a composite of at least two layers of different dielectric materials formed sequentially.

18. The method of claim 11 , wherein said dielectric layer is a composite of at least two different dielectric materials deposited simultaneously.

19. The method of claim 11 , wherein said dielectric layer contains at least one dielectric material selected from the group consisting of boron carbide, silicon carbide, silicon dioxide, silicon nitride, CVD diamond, aluminum silicates, glass ceramics, and fluorocarbon polymers.

20. The method of claim 11 , wherein said metal layer has a thickness within a range of about 0.0508 mm to 0.0762mm.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded May 1, 2011
From: COMERICA BANK
To: NXEDGE, INC. OF BOISE
Reel/Frame 026205/0756 →
SECURITY INTEREST Recorded Sep 30, 2004
From: NXEDGE INC. OF BOISE, A DELAWARE CORPORATION
To: COMERICA BANK
Reel/Frame 015945/0175 →
Continuity (2)
Provisional Application 6034866600 · Jan 15, 2002
Related Publication 20030180556A1 · Sep 25, 2003