IP Library › Granted Patent US 6,877,383
Granted Patent B2
US 6,877,383 · App. 10/247,637 · Granted Apr 12, 2005

Capacitive type pressure sensor

Assignees: Hitachi, Ltd.; Hitachi Car Engineering Co., Ltd.
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Quick Facts
Patent No.
US 6,877,383
App. No.
10/247,637
Granted
Apr 12, 2005
Kind
B2
Abstract

By sealing a diaphragm with less processes and lower cost and reducing deformation due to remaining stress, a stable and highly reliable pressure sensor construction is proposed. The pressure sensor is low in measurement error and small in floating capacitance and leakage current and good in characteristic. As a means to attain the above object, a polycrystalline silicon diaphragm is sealed with a silicon oxide film deposited through a LPCVD method and then completely covered. The diaphragm is placed on a surface of a semiconductor substrate with a nearly constant gap of 0.15 to 1.3 μm, and has difference-in-grade constructions of a deformation reducing means due to remaining stress.

Claims (7)

1. A semiconductor pressure sensor comprising a diaphragm which is deformed in correspondence with a pressure of fluid to be measured, wherein

said diaphragm is made of an electrically conductive polycrystalline silicon film formed by using a process for etching a sacrifice layer on one surface of a silicon substrate,

a pressure receiving surface of said diaphragm which is contacted to said fluid is covered with an insulation film, and

said pressure receiving surface covered with said insulation film is further covered with an electrically conductive film for electromagnetic shielding which is made of an electrically conductive polycrystalline silicon film and is in a grounded state

said insulation film and said electrically conductive film for said electromagnetic shielding are formed on a surface of said silicon substrate where said diaphragm is not formed, a lead for grounding is formed so as to be covered with said insulation film and said electrically conductive film for said electromagnetic shielding, and said electrically conductive film for said electromagnetic shielding is connected to said lead for grounding through a hole provided on said insulation film.

2. The semiconductor pressure sensor according to claim 1 , wherein

a fixed electrode is arranged on said silicon substrate at a position against said diaphragm, said diaphragm is constructed as a movable electrode, and said pressure is detected by converting a capacitance between said movable electrode and said fixed electrode into an electrical signal.

Priority Claims (3)
JP 10-85444 · Mar 31, 1998 · national
JP 10-85641 · Mar 31, 1998 · national
JP 10-266426 · Sep 21, 1998 · national
Continuity (2)
Continuation 0928215400 · Mar 31, 1999
Related Publication 20030019299A1 · Jan 30, 2003