Metallization of nucleic acids via metal nanoparticles produced ex-situ
The invention relates to a process for the metallization of nucleic acids, comprising providing tris(hydroxymethyl)phosphine-Au (THP-Au) particles or derivatives thereof, binding said THP-Au particles to a nucleic acid to produce a metal nanoparticle-nucleic acid composite, and treatment of the metal nanoparticle-nucleic acid composite with an electroless plating solution. The invention further relates to a metallized nucleic acid obtainable according to such a method and a nanowire including a method for the manufacture of a nanowire.
1. A process for the metallisation of nucleic acids, comprising
providing a sol of tris(hydroxymethyl)phosphine-Au (THP-Au) particles in a solution of water or mixed water-organic solvents;
binding said THP-Au to a nucleic acid to produce a metal nanoparticle-nucleic acid composite by treating the nucleic acid with said sol of THP-Au; and
treating the metal nanoparticle-nucleic acid composite with an electroless plating solution.
2. The process according to claim 1 , wherein the nucleic acid is immobilized on a substrate prior to the step of binding the THP-Au particles and wherein the step of binding THP-Au particles is performed by treating the nucleic acid with said sot of THP-Au on the substrate.
3. The process according to claim 1 , wherein the nucleic acid is selected from the group consisting of DNA, RNA, PNA, CNA, oligonucleotides, oligonucleotides of DNA, oligonucleotides of RNA, primers, A-DNA, B-DNA, Z-DNA, polynucleotides of DNA, polynucleotides of RNA, T-junctions of nucleic acids, triplexes of nucleic acids, quadruplexes of nucleic acids, domains of non-nucleic acid polymer-nucleic acid blockcopolymers and combinations thereof.
4. The process according to claim 1 , wherein the nucleic acid is double-stranded or single-stranded.
5. The process according to claim 1 , wherein said THP-Au has a core diameter of 0.5-5 nm.
6. The process according to claim 1 , wherein said THP-Au are at a concentration of 1 μM-1 mM.
7. The process according to claim 1 , wherein said binding step is performed at a temperature 0-80° C.
8. The process according to claim 1 , wherein the reaction is at a pH of 2-10.
9. The process according to claim 1 , wherein a water miscible organic solvent additive is used in a concentration 0.1-95% by volume.
10. The process according to claim 1 , wherein a gold(I)-complex additive is used in a concentration of 1 μM-0.1 M.
11. The process according to claim 1 , wherein a salt additive is used in a concentration of 1 μM-10 M.
12. The process according to claim 1 , wherein a kosmotropic additive is used in a concentration of 1 mM-10 M.
13. The process according to claim 1 , wherein the metal nanoparticles nucleic acid composite is treated with an electroless plating solution while said composite is dissolved in solution, attached by one or two of its ends, immobilised on a substrate or in a semisolid state.
14. The process according to claim 1 , wherein the metal in the core of the nanoparticles is selected from the group consisting of Fe, Co, Ni, Cu, Ru, Rh, Pd, Os, Ir, Ag, Pt, Au or combinations-of these metals.
15. The process according to claim 1 , wherein the THP is condensed with a primary or secondary amine.
16. The process according to claim 1 , wherein the metal nanoparticles are treated with an electroless plating solution consisting of at least one of the metals selected from the group comprising Fe, Co, Ni, Cu, Ru, Rh, Pd, Os, Ir, Ag, Pt, Au or combinations of these metals.
17. A metallised nucleic acid obtainable according to the process of claim 1 .
18. A method for the manufacture of a nanowire, comprising the metallisation of a nucleic acid according to claim 1 .
19. A nanowire obtainable according to a process of claim 18 .
20. The nanowire according to claim 19 having a structure containing a THP-Au/nucleic acid composite.
21. A small-scale network or electronic circuit, comprising at least one nanowire according to claim 19 .
22. The process according to claim 5 , wherein said THP-Au has a core diameter of 1-3 nm.
23. The process according to claim 6 , wherein said THP-Au are at a concentration of 10 μM-0.1 mM.
24. The process according to claim 7 , wherein binding is performed at a temperature of 20-50° C.
25. The process according to claim 8 , wherein the pH of the reaction is 4-8.
26. The process according to claim 9 , wherein said water miscible organic solvent additive is used in a concentration of 1-90% by volume.
27. The process according to claim 10 , wherein said gold(I)-complex additive is used in a concentration of 0.1 mM-10 mM.
28. The process according to claim 11 , wherein the salt additive is used in a concentration of 0.1 mM-1 M.
29. The process according to claim 12 , wherein the kosmotropic additive is used in a concentration 10 mM-1 M.
30. The process according to claim 13 , wherein said semisolid state is a gel.
31. The process according to claim 14 , wherein said combinations are alloys.
32. The process according to claim 16 , wherein said combinations arc alloys.