Light emitting device and method of manufacturing the same
View Patent ↗An easier method is provided to manufacture a light emitting device that can display a full-color image using a polymeric organic compound. In the present invention, some of polymeric organic compounds are dissolved in a protic solvent while the others are dissolved in an aprotic solvent and the obtained solutions are applied to form organic compound films having laminate structures. A conductive film to serve as an etching stopper is formed on the organic compound films, so that portions of the organic compound films that do not overlap the conductive film are etched away. By using wet etching and dry etching in combination, different organic compound films each composed of a plurality of polymeric organic compounds can be formed in different light emitting elements on the same substrate.
1. A method of manufacturing a light emitting device, said method comprising:
forming a second organic compound layer on a first organic compound layer;
forming a first conductive film on the second organic compound layer;
etching a portion of the second organic compound layer by a wet etching, wherein the portion of the second organic compound layer does not overlap the first conductive film;
forming a third organic compound layer on the first organic compound layer;
forming a second conductive film on the third organic compound layer;
etching a portion of the first organic compound layer by a dry etching, wherein the portion of the first organic compound layer does not overlap the first and second conductive films,
wherein the first organic compound layer is formed by applying a solution including a protic solvent,
wherein each of the second and third organic compound layers is formed by applying a solution including an aprotic solvent.
2. A method of manufacturing a light emitting device, said method comprising:
forming a second organic compound layer on a first organic compound layer;
forming a first conductive film on the second organic compound layer;
etching a portion of the second organic compound layer by a wet etching,
wherein the portion of the second organic compound layer does not overlap the first conductive film;
forming a third organic compound layer on the first organic compound layer;
forming a second conductive film on the third organic compound layer;
etching a portion of the third organic compound layer and a portion of the first organic compound layer by irradiating with O 2 plasma, wherein the portion of the first organic compound layer does not overlap the first and second conductive films, and wherein the portion of the third organic compound layer does not overlap the second conductive film,
wherein the first organic compound layer is formed by applying a solution including a protic solvent,
wherein each of the second and third organic compound layers is formed by applying a solution including an aprotic solvent.
3. A method according to claim 1 ,
wherein the first organic compound layer comprises at least one selected from the group consisting of PEDOT and polyaniline.
4. A method according to claim 1 ,
wherein each of the second and third organic compound layers comprises at least one selected from the group consisting of a polyparaphenylene vinylene derivative, a polythiophene derivative, a polyfluolene derivative, a polyparaphenylene derivative, a polyalkylphenylene and a polyacetylene derivative.
5. A method according to claim 1 ,
wherein each of the second and third organic compound layer comprises at least one selected from the group consisting of poly(2,5-dialkoxy-1,4-phenylenevinylene), poly(2-dialkoxyphenyl-1,4-phenylenevinylene), poly(2-methoxy-5-(2-ethyl-hexoxy)-1,4-phenylenevinylene), poly(2,5-dimethyloctylsilyl-1,4-phenylenevinylene), poly(2,5-dialkoxy-1,4-phenylene), poly(3-alkylthiophene), poly(3-hexylthiophene), poly(3-cyclohexylthiophene), poly(3-cyclohexyl-4-methylthiophene), poly(3-[4-octylphenyl]-2,2′-bithiophene), poly(3-(4-octylphenyl)-thiophene), poly(dialkylfluorene), poly(dioctylfluorene), polypropylphenylacetylene, poly[1-(p-n-butylphenyl)-2-phenylacetylene, and polyhexylphenylacetylene.
6. A method of manufacturing a light emitting device, and method comprising:
forming an anode on an insulating surface;
forming an insulating film to cover edges of the anode;
forming a first organic compound layer on the anode and the insulating film;
forming a second organic compound layer on the first organic compound layer;
forming a first conductive film on the second organic compound layer;
etching a portion of the second organic compound layer by a wet etching, wherein the portion of the second organic compound layer does not overlap the first conductive film;
forming a third organic compound layer on the first organic compound layer;
forming a second conductive film on the third organic compound layer;
etching a portion of the third organic compound layer by a wet etching, wherein the portion of the third organic compound layer does not overlap the second conductive film;
forming a fourth organic compound layer on the first organic compound layer;
forming a third conductive film on the fourth organic compound layer;
etching a portion of the fourth organic compound layer and a portion of the first conductive film by dry etching, wherein the portion of the fourth organic compound layer does not overlap the third conductive film, and wherein the portion of the first organic compound layer does not overlap the first, second and third conductive films.
7. A method of manufacturing a light emitting device, said method comprising:
forming an anode on an insulating surface;
forming an insulating film to cover edges of the anode;
forming a first organic compound layer on the anode and the insulating film;
forming a second organic compound layer on the first organic compound layer;
forming a first conductive film on the second organic compound layer;
etching a portion of the second organic compound layer by a wet etching, wherein the portion of the second organic compound layer does not overlap the first conductive film;
forming a third organic compound layer on the first organic compound layer;
forming a second conductive film on the third organic compound layer;
etching a portion of the third organic compound layer by a wet etching, wherein the portion of the third organic compound layer does not overlap the second conductive film;
forming a fourth organic compound layer on the first organic compound layer;
forming a third conductive film on the fourth organic compound layer;
etching a portion of the fourth organic compound layer and a portion of the first conductive film by irradiating with O 2 plasma, wherein the portion of the fourth organic compound layer does not overlap the third conductive film, and wherein the portion of the first organic compound layer does not overlap the first, second and third conductive films.
8. A method according to claim 6 ,
wherein the first organic compound layer comprises at least one selected from the group consisting of PEDOT and polyaniline.
9. A method according to claim 6 ,
wherein each of the second, third and fourth organic compound layers comprises at least one selected from the group consisting of a polyparaphenylene vinylene derivative, a polythiophene derivative, a polyfluolene derivative, a polyparaphenylene derivative, a polyalkylphenylene and a polyacetylene derivative.
10. A method according to claim 6 ,
wherein each of the second, third and fourth organic compound layers comprises at least one selected from the group consisting of poly(2,5-dialkoxy-1,4-phenylenevinylene), poly(2-dialkoxyphenyl-1,4-phenylenevinylene), poly(2-methoxy-5-(2-ethyl-hexoxy)-1,4-phenylenevinylene), poly(2,5-dimethyloctylsilyl-1,4-phenylenevinylene), poly(2,5-dialkoxy-1,4-phenylene), poly(3-alkylthiophene), poly(3-hexylthiophene), poly(3-cyclohexylthiophene), poly(3-cyclohexyl-4-methylthiophene), poly(3-[4-octylphenyl]-2,2′-bithiophene), poly(3-(4-octylphenyl) -thiophene), poly(dialkylfluorene), poly(dioctylfluorene), polypropylphenylacetylene, poly[1-(p-n-butylphenyl)-2-phenylacetylene, and polyhexylphenylacetylene.
11. A method according to claim 1 ,
wherein an aprotic solvent is used in the wet etching.
12. A method according to claim 11 ,
wherein the aprotic solvent comprises at least one selected from the group consisting of toluene, benzene, chlorobenzene, dichlorobenzene, chloroform, tetralin, xylene, anisole, dichloromethane, γ-butyrolactone, butylcellosolve, cyclohexane, NMP (N-methyl-2-pyrrolidone), dimethyl sulfoxide, cyclohexanone, dioxane and THF (tetrahydrofuran).
13. A method according to claim 1 ,
wherein the light emitting device is one selected from the group consisting of a display device, a digital still camera, a notebook type personal computer, a mobile computer, an image reproduction apparatus including a recording medium, a goggle type display, a video camera, and a mobile phone.
14. A method according to claim 2 ,
wherein the first organic compound layer comprises at least one selected from the group consisting of PEDOT and polyaniline.
15. A method according to claim 2 ,
wherein each of the second and third organic compound layers comprises at least one selected from the group consisting of a polyparaphenylene vinylene derivative, a polythiophene derivative, a polyfluolene derivative, a polyparaphenylene derivative, a polyalkylphenylene and a polyacetylene derivative.
16. A method according to claim 2 ,
wherein each of the second and third organic compound layer comprises at least one selected from the group consisting of poly(2,5-dialkoxy-1,4-phenylenevinylene), poly(2-dialkoxyphenyl-1,4-phenylenevinylene), poly(2-methoxy-5-(2-ethyl-hexoxy)-1,4-phenylenevinylene), poly(2,5-dimethyloctylsilyl-1,4-phenylene vinylene), poly(2, 5-dialkoxy-1,4-phenylene), poly(3-alkylthiophene), poly(3-hexylthiophene), poly(3-cyclohexylthiophene), poly(3-cyclohexyl-4-methylthiophene), poly(3-[4-octylphenyl]-2,2′-bithiophene), poly(3-(4-octylphenyl)-thiophene), poly(dialkylfluorene), poly(dioctylfluorene), polypropylphenylacetylene, poly[1-(p-n-butylphenyl)-2-phenylacetylene, and polyhexylphenylacetylene.
17. A method according to claim 2 ,
wherein an aprotic solvent is used in the wet etching.
18. A method according to claim 17 ,
wherein the aprotic solvent comprises at least one selected from the group consisting of toluene, benzene, chlorobenzene, dichlorobenzene, chloroform, tetralin, xylene, anisole, dichloromethane, γ-butyrolactone, butylcellosolve, cyclohexane, NMP (N-methyl-2-pyrrolidone), dimethyl sulfoxide, cyclohexanone, dioxane and THF (tetrahydrofuran).
19. A method according to claim 2 ,
wherein the light emitting device is one selected from the group consisting of a display device, a digital still camera, a notebook type personal computer, a mobile computer, an image reproduction apparatus including a recording medium, a goggle type display, a video camera, and a mobile phone.
20. A method according to claim 6 ,
wherein an aprotic solvent is used in the wet etching.
21. A method according to claim 20 ,
wherein the aprotic solvent comprises at least one selected from the group consisting of toluene, benzene, chlorobenzene, dichlorobenzene, chloroform, tetralin, xylene, anisole, dichloromethane, γ-butyrolactone, butylcellosolve, cyclohexane, NMP (N-methyl-2-pyrrolidone), dimethyl sulfoxide, cyclohexanone, dioxane and THF (tetrahydrofuran).
22. A method according to claim 6 ,
wherein the light emitting device is one selected from the group consisting of a display device, a digital still camera, a notebook type personal computer, a mobile computer, an image reproduction apparatus including a recording medium, a goggle type display, a video camera, and a mobile phone.
23. A method according to claim 7 ,
wherein the first organic compound layer comprises at least one selected from the group consisting of PEDOT and polyaniline.
24. A method according to claim 7 ,
wherein each of the second, third and fourth organic compound layers comprises at least one selected from the group consisting of a polyparaphenylene vinylene derivative, a polythiophene derivative, a polyfluolene derivative, a polyparaphenylene derivative, a polyalkylphenylene and a polyacetylene derivative.
25. A method according to claim 7 ,
wherein each of the second, third and fourth organic compound layers comprises at least one selected from the group consisting of poly(2,5-dialkoxy-1,4-phenylenevinylene), poly(2-dialkoxyphenyl-1,4-phenylenevinylene), poly(2-methoxy-5-(2-ethyl-hexoxy)-1,4-phenylenevinylene), poly(2,5-dimethyloctylsilyl-1,4-phenylenevinylene), poly(2,5-dialkoxy-1,4-phenylene), poly(3-alkylthiophene), poly(3-hexylthiophene), poly(3-cyclohexylthiophene), poly(3-cyclohexyl-4-methylthiophene), poly(3-[4-octylphenyl]-2,2′-bithiophene), poly(3-(4-octylphenyl)-thiophene), poly(dialkylfluorene), poly(dioctylfluorene), polypropylphenylacetylene, poly[1-(p-n-butylphenyl)-2-phenylacetylene, and polyhexylphenylacetylene.
26. A method according to claim 7 ,
wherein an aprotic solvent is used in the wet etching.
27. A method according to claim 26 ,
wherein the aprotic solving comprises at least one selected from the group consisting of toluene, benzene, chlorobenzene, dichlorobenzene, chloroform, tetralin, xylene, anisole, dichloromethane, γ-butyrolactone, butylcellosolve, cyclohexane, NMP (N-methyl-2-pyrrolidone), dimethyl sulfoxide, cyclohexanone, dioxane and THF (tetrahydrofuran).
28. A method according to claim 7 ,
wherein the light emitting device is one selected from the group consisting of a display device, a digital still camera, a notebook type personal computer, a mobile computer, an image reproduction apparatus including a recording medium, a goggle type display, a video camera, and a mobile phone.