Modular packaging arrangements and methods
View Patent ↗The present invention relates generally to chip packaging and methods of packaging and, more particularly, to compact packaging of chips and methods thereof in electronic environments that minimize undesired electronic effects, promote speed, and enhance packaging versatility.
1. A packaging apparatus comprising:
a chip module including a housing assembly and a chip assembly within the housing assembly; the housing assembly including at least one socket to receive at least one functional component assembly therein;
at least one functional component assembly to be removably received within the socket and coupled to the chip assembly in an overlying juxtaposed relationship;
the functional component assembly comprising:
a printed circuit board sized and shaped to closely fit within the socket; and,
a plurality of functional components mounted on a first surface of the printed circuit board and which are electrically coupled to the chip assembly; and,
a coupling apparatus for releasably mechanically coupling the printed circuit board within the socket and electrically to the chip module.
2. The packaging apparatus of claim 1 , wherein the one functional component includes electrical conductors extending therefrom and electrically connected to lead frames on a second surface of the printed circuit board that is received within the socket.
3. The packaging apparatus of claim 2 , wherein the chip module includes an insulative member including a plurality of electrical contacts housed therein, the lead frames of the printed circuit board are electrically coupled to the plurality of electrical contacts of the insulative member.
4. The packaging apparatus of claim 3 , wherein the insulative member is comprised of a relatively thin planar dielectric board, and a plurality of electrical conductors on the dielectric board extend from the bottom of each of the electrical contacts of the insulative member to lateral edges of the insulative member, the electrical conductors extend to individual contact points on the top of the insulative member; and, a plurality of conducting wires are wire bonded so as to be electrically connected from the contact points to a semiconductor die attach and/or to at least individual elements of a ball grid array.
5. The packaging apparatus of claim 3 , wherein the electrical contacts include fuzz buttons.
6. The packaging apparatus of claim 1 , wherein the releasably mechanical coupling apparatus includes one or more quick-disconnect coupling elements, wherein the coupling elements are made of a resiliently deformable connector positioned adjacent edges of at least one of the one functional component that is received within the socket of the housing assembly.
7. The packaging apparatus of claim 1 wherein the one functional component is selected from a group consisting at least one active component, passive component, semiconductor assembly, semiconductor chip, semiconductor memory device, connector, and bus.