Low formaldehyde emission coatings and binders from formaldehyde-based resins
Disclosed is a low formaldehyde emission coating from formaldehyde-based resins that can be applied to a panel for reducing sag and enhancing the strength of the panel. Formaldehyde emissions are reduced by the inclusion of polymeric formaldehyde reactive materials comprising a polyamide scavenger into the coating formula. These formulations are useful as coatings or binders.
1. A method of making a coating comprising:
providing a formaldehyde resin;
providing a formaldehyde scavenger, the formaldehyde scavenger being a polyamide;
combining the resin and scavenger;
heating the resin and scavenger at a temperature in the range from about 450° F. to about 650° F.
2. The method of claim 1 , wherein the polyamide is a synthetic polyamide.
3. The method of claim 2 , wherein the synthetic polyamide is selected from the group consisting essentially of polyacrylamides, polymethacrylamides , polyamide telomers, polyamide polymers, polyamide copolymers, polyamide terpolymers, polyamide tetrapolymers, N-substituted polyamides and combinations thereof.
4. The method of claim 2 , wherein the protein is selected from the group consisting of casein, soy protein and combinations thereof.
5. The method of claim 1 , wherein the polyamide is a protein.
6. The method of claim 1 , wherein the formaldehyde resin is selected from the group consisting of melamine formaldehyde, urea formaldehyde, phenol formaldehyde and combinations thereof.
7. The method of claim 6 , wherein the catalyst comprises an acid catalyst.
8. The method of claim 1 , further including the components selected from the group consisting of catalysts, fillers, surfactants, buffers, viscosity controllers, pigments, flattening agents and combinations thereof.
9. The method of claim 1 , wherein the coating comprises formaldehyde scavenger in an amount from about 3% to about 50% by dry weight based on the dry weight of the formaldehyde resin.