Sulfoxide pyrolid(in)one alkanolamine cleaner composition
The present invention relates to, inter alia, a composition for stripping photoresist from substrates comprising: about 5% to about 50% by weight of an alkyl substituted pyrrolidone, an alkyl substituted piperidone, or a mixture thereof, about 0.2% to about 20% of one or more alkanolamines, and about 50% to about 94% of a sulfoxide, sulfoxone, or mixture thereof. Advantageously, the composition can remove copper from a copper substrate at a rate of less than about 10 Å per minute when the substrate is immersed in the composition which is held at 70° C. for 30 minutes and rotated relative to the composition at about 200 revolutions per minute.
1. A composition for stripping photoresist from substrates comprising:
about 5% to about 50% by weight of an alkyl substituted pyrrolidone, an alkyl substituted piperidone, or a mixture thereof;
about 0.2% to about 20% of one or more alkanolamines, and
about 50% to about 94% of a sulfoxide, sulfoxone, or mixture thereof,
wherein the composition removes copper from a copper substrate at a rate of less than about 10 Å per minute when the substrate is immersed in the composition which is held at 70° C. for 30 minutes and rotated relative to the composition at about 200 revolutions per minute; and
wherein the composition comprises no more than about 2% water.
2. The composition of claim 1 , wherein the composition comprises from about 15% to about 35% of an alkyl-2-pyrolidinone, from about 0.5% to about 10% of one or more alkanolamines, and from about 60% to about 84% of a sulfoxide, sulfoxone, or mixture thereof.
3. The composition of claim 1 , wherein the composition comprises from about 20% to about 30% of an alkyl-2-pyrolidinone, from about 1% to about 5% of one or more alkanolamines, from about 66% to about 76% of a sulfoxide, sulfoxone, or mixture thereof.
4. The composition of claim 1 , wherein: the substituted pyrrolidone, substituted piperidone, or mixture thereof consists essentially of N-methyl-2-pyrolidinone, N-hydroxyethyl-2-pyrrolidinone, or mixture thereof; the alkanolamine consists essentially of monoethanolamine, 2-(2-aminoethoxy)ethanol, 2-(2-aminoethylamino)ethanol, monoisopropanolamine, diethanolamine, triethanolamine, 2-(methylamino)ethanol, or a mixture thereof; and the sulfoxide, sulfoxone, or mixture thereof consists essentially of dimethyl sulfoxide (DMSO), dipropylsulfoxide, diethylsulfoxide, methylethylsulfoxide, diphenylsulfoxide, methylphenylsulfoxide, 1,1′-dihydroxyphenyl sulfoxide, or a mixture thereof, and wherein the composition removes copper from the copper substrate at a rate of less than about 5 Å per minute when the substrate is immersed in the composition which is held at 70° C. for 30 minutes and rotated relative to the composition at about 200 revolutions per minute.
5. The composition of claim 1 , wherein: the substituted pyrrolidone, substituted piperidone, or mixture thereof consists essentially of N-methyl-2-pyrolidinone; the alkanolamine consists essentially of monoethanolamine, diethanolamine, 2-(methylamino)ethanol, or a mixture thereof; and the sulfoxide, sulfoxone, or mixture thereof consists essentially of dimethyl sulfoxide.
6. The composition of claim 1 , comprising about 68% to about 74% of dimethyl sulfoxide, methyl sulfoxide, or mixture thereof; about 23% to about 29% of 1-Methyl-2-pyrrolidinone; and about 1% to about 5% of 2-(Methylamino)ethanol, diethanolamine, or mixture thereof.
7. The composition of claim 1 , comprising no more than about 1% water.
8. The composition of claim 1 , further comprising at least one of a surfactant, chelating agent, or corrosion inhibitor, wherein the total concentration of surfactants, chelating agents, and corrosion inhibitors is less than about 5% by weight.
9. A method of using the composition of claim 1 comprising:
contacting the surface of a substrate with hardened photoresist thereon for a time and at a temperature sufficient to remove the photoresist; and
rinsing the substrate with water, isopropyl alcohol, or a mixture thereof.
10. The method of claim 9 , wherein a surface of the substrate comprises copper or a low-K material.
11. A composition for stripping photoresist from substrates comprising:
about 15% to about 25% by weight of an alkyl substituted pyrrolidone, an alkyl substituted piperidone, or a mixture thereof;
about 30% to about 50% of one or more alkanolamines;
about 25% to about 45% of a substituted or unsubstituted sulfoxide, a substituted or unsubstituted sulfoxone, or a mixture thereof; and
less than about 1% water,
wherein the composition removes copper from a copper substrate at a rate of less than about 10 Å per minute when the substrate is immersed in the composition which is held at 70° C. for 30 minutes and rotated relative to the composition at about 200 revolutions per minute.
12. The composition of claim 11 , comprising about 15% to about 25% of a substituted piperidone; 30% to about 50% of monoethanolamine, 2-(2-aminoethoxy)ethanol, 2-(2-aminoethylamino)ethanol, monoisopropanolamine, diethanolamine, triethanolamine, 2-(methylamino)ethanol, or a mixture thereof; and about 25% to about 45% of an alkylsulfoxide.
13. The composition of claim 11 , comprising about 17% to about 23% of 1,3-dimethyl-2-piperidone, 1,5-dimethyl-2-piperidone, or a mixture thereof; about 40% to about 45% of monomethylethanolamine, diethanolamine, or a mixture thereof; about 30% to about 40% of dimethyl sulfoxide, methyl sulfoxide, or a mixture thereof.
14. The composition of claim 11 , comprising at least one of gamma-butyrolactone, diglycolamine, propylene glycol, morpholine, and mixtures thereof.
15. The composition of claim 11 , comprising at least one of a surfactant, a chelating agent, and a corrosion inhibitor, wherein the total concentration of surfactants, chelating agents, and corrosion inhibitors is less than about 5% by weight.
16. A method of using the composition of claim 11 , comprising:
contacting the surface of a substrate with hardened photoresist thereon with the composition of claim 11 for a time and at a temperature sufficient to remove the photoresist; and
rinsing the substrate with water, isopropyl alcohol, or a mixture thereof.
17. The method of claim 16 , wherein a surface of the substrate comprises copper or a low-K material.
18. A composition for stripping photoresist from substrates consisting essentially of:
about 5% to about 50% by weight of an alkyl substituted pyrrolidone, an alkyl substituted piperidone, or a mixture thereof;
about 0.2% to about 60% of one or more alkanolamines:
about 20% to about 80% of alkylsulfoxide, alkylsulfone, or a mixture thereof;
less than about 0.5% water;
optionally at least one of gamma-butyrolactone, diglycolamine, propylene glycol, morpholine, and mixtures thereof; and
optionally at least one of a surfactant, a chelating agent, and a corrosion inhibitor, wherein the total concentration of surfactants, chelating agents, and corrosion inhibitors is less than about 5% by weight;
wherein the composition removes copper from a copper substrate at a rate of less than about 10 Å per minute when the substrate is immersed in the composition which is held at 70° C. for 30 minutes and rotated relative to the composition at about 200 revolutions per minute.
19. The composition of claim 18 , comprising about 10% to about 35% of 1-hydroxyethyl-2-pyrolidinone, N-methyl-2-pyrolidinone, 1,3-dimethyl-2-piperidone, 1,5-dimethyl-2-piperidone, or a mixture thereof; about 2% to about 45% of monoethanolamine, diethanolamine, 2-(methylamino)ethanol, or a mixture thereof; and about 30% to about 75% of dimethyl sulfoxide, methyl sulfoxide, or a mixture thereof.
20. The composition of claim 18 , comprising about 20% to about 26% of 1-hydroxyethyl-2-pyrolidinone, N-methyl-2-pyrolidinone, 1,3-dimethyl-2-piperidone, 1,5-dimethyl-2-piperidone, or a mixture thereof; about 2% to about 45% of monoethanolamine, diethanolamine, 2-(methylamino)ethanol, or a mixture thereof; and about 30% to about 75% of dimethyl sulfoxide, methyl sulfoxide, or a mixture thereof, and wherein the composition does not change the refractive index of both low-k substrate SIOC and HSQ by more than 0.02 when the substrate is immersed in the composition which is held at 70° C. for 30 minutes and rotated relative to the composition at about 200 revolutions per minute.
21. The composition of claim 18 , wherein the composition removes copper from a copper substrate at a rate of less than about 5 Å per minute when the substrate is immersed in the composition which is held at 70° C. for 30 minutes and rotated relative to the composition at about 200 revolutions per minute.
22. The composition of claim 18 , comprising at least one of gamma-butyrolactone, diglycolamine, propylene glycol, morpholine, and mixtures thereof.
23. The composition of claim 18 , comprising at least one of a surfactant, a chelating agent, and a corrosion inhibitor, wherein the total concentration of surfactants, chelating agents, and corrosion inhibitors is less than about 5% by weight.
24. The composition of claim 18 , which does not increase the copper etch rate for the composition more than about 4 Å per minute greater than the etch rate of the composition when waterless.
25. A method of stripping photoresist from a substrate comprising:
contacting the composition of claim 18 with a surface of a substrate with hardened photoresist thereon for a time and at a temperature sufficient to remove the photoresist; and
rinsing the substrate with water, isopropyl alcohol, or a mixture thereof.
26. The method of claim 25 , wherein a surface of the substrate comprises copper or a low-K material.
27. The method of claim 25 , wherein the time is between about 1 to about 60 minutes and the temperature is from about 45° C. to about 80° C.
28. A composition for stripping photoresist from substrates comprising: about 20% to about 30% of an alkyl-2-pyrolidinone, wherein the total amount of alkyl substituted pyrrolidone and alkyl substituted piperidone is 50% or less;
about 1% to about 5% of one or more alkanolamines; and
about 66% to about 76% of a sulfoxide, sulfoxone, or mixture thereof,
wherein the composition removes copper from a copper substrate at a rate of less than about 10 Å per minute when the substrate is immersed in the composition which is held at 70° C. for 30 minutes and rotated relative to the composition at about 200 revolutions per minute.
29. A method of using the composition of claim 28 , comprising:
contacting the surface of a substrate with hardened photoresist thereon with the composition of claim 28 for a time and at a temperature sufficient to remove the photoresist; and rinsing the substrate with a rinse comprising water, isopropyl alcohol, or a mixture thereof.
30. The composition for stripping photoresist of claim 28 comprising:
about 23% to about 29% of 1-Methyl-2-pyrrolidinone;
about 1% to about 5% of 2-(Methylamino)ethanol, diethanolamine, or mixture thereof; and
about 68% to about 74% of dimethyl sulfoxide, methyl sulfoxide, or mixture thereof.
31. A method of using the composition of claim 30 , comprising:
contacting the surface of a substrate with hardened photoresist thereon with the composition of claim 30 for a time and at a temperature sufficient to remove the photoresist; and rinsing the substrate with a rinse comprising water, isopropyl alcohol, or a mixture thereof.
32. The composition for stripping photoresist of claim 11 comprising:
about 15% to about 25% of an alkyl-substituted piperidone;
30% to about 50% of monoethanolamine, 2-(2-aminoethoxy)ethanol, 2-(2-aminoethylamino)ethanol, monoisopropanolamine, diethanolamine, triethanolamine, 2-(methylamino)ethanol, or a mixture thereof; and
about 25% to about 45% of an alkyl-substituted sulfoxide.
33. A method of using the composition of claim 32 , comprising:
contacting the surface of a substrate with hardened photoresist thereon with the composition of claim 32 for a time and at a temperature sufficient to remove the photoresist; and rinsing the substrate with a rinse comprising water, isopropyl alcohol, or a mixture thereof.
34. A composition for stripping photoresist from substrates comprising:
about 10% to about 30% by weight of an alkyl substituted pyrrolidone, an alkyl substituted piperidone, or a mixture thereof;
about 20% to about 50% of one or more alkanolamines;
about 20% to about 55% of an alkyl-substituted sulfoxide, an unsubstituted sulfoxide, an alkyl-substituted sulfoxone, an unsubstituted sulfoxone, or a mixture thereof;
less than about 1% water; and
further comprising at least one of gamma-butyrolactone, propylene glycol, or morpholine;
wherein the composition removes copper from a copper substrate at a rate of less than about 10 Å per minute when the substrate is immersed in the composition which is held at 70° C. for 30 minutes and rotated relative to the composition at about 200 revolutions per minute.
35. A method of using the composition of claim 34 , comprising:
contacting the surface of a substrate with hardened photoresist thereon with the composition of claim 34 for a time and at a temperature sufficient to remove the photoresist; and rinsing the substrate with a rinse comprising water, isopropyl alcohol, or a mixture thereof.
36. A composition for stripping photoresist from substrates consisting essentially of:
between about 15 parts to about 35 parts by weight of one or more substituted pyrrolidones, substituted piperidones, or mixture thereof;
between about 1 part and about 5 parts by weight of one or more alkanolamines;
between about 60 parts to about 84 parts of one or more alkylsulfoxides;
optionally up to 10 parts by weight total of surfactants, chelating agents, and corrosion inhibitors; and
less than about 4 parts by weight of water.
37. A method of using the composition of claim 36 , comprising:
contacting the surface of a substrate with hardened photoresist thereon with the composition of claim 36 for a time and at a temperature sufficient to remove the photoresist; and rinsing the substrate with a rinse comprising water, isopropyl alcohol, or a mixture thereof.