Layered phosphor coatings for LED devices

1. A light emitting device comprised of a light emitting diode on a mounting surface, said mounting surface comprises a curved reflector, said light emitting diode including a substrate layer comprised of silicon carbide and at least one active region, at least one resilient substantially transparent and substantially phosphor free polymer layer extending from said mounting surface to above at least one quarter of a height of the substrate layer and below a top surface of the light emitting diode, and at least a second layer containing phosphor extending from said phosphor free polymer layer to a height above a top surface of said light emitting diode.

2. The light emitting device of claim 1 wherein said polymer is selected from silicone, epoxy or hybrids thereof.

3. The light emitting device of claim 1 wherein said material containing said phosphor is selected from silicone, epoxy, or hybrid thereof, or volatile organic liquids or semi-liquids.

4. A light emitting device comprised of a light emitting diode on a mounting surface, said light emitting diode including a substrate layer comprised of silicon carbide and at least one active region, said substrate has a height of at least 150 μm, at least one resilient substantially transparent and substantially phosphor free polymer layer extending from said mounting surface to above at least one quarter of a height of the substrate layer and below a top surface of the light emitting diode, and at least a second layer containing phosphor extending from said phosphor free polymer layer to a height above a top surface of said light emitting diode.

5. The light emitting device of claim 1 wherein said active region comprises at least gallium and nitride.

6. A light emitting device comprised of a light emitting diode emitting lights between 360 and 420 nanometers on a mounting surface, said light emitting diode including a substrate layer comprised of silicon carbide and at least one active region, at least one resilient substantially transparent and substantially phosphor free polymer layer extending from said mounting surface to above at least one quarter of a height of the substrate layer and below a top surface of the light emitting diode, and at least a second layer containing phosphor extending from said phosphor free polymer layer to a height above a top surface of said light emitting diode.

7. A light emitting device comprised of a light emitting diode on a mounting surface and an encapsulant layer, said light emitting diode including a substrate layer comprised of silicon carbide and at least one active region, at least one resilient substantially transparent and substantially phosphor free polymer layer extending from said mounting surface to above at least one quarter of a height of the substrate layer and below a top surface of the light emitting diode, and at least a second layer containing phosphor extending from said phosphor free polymer layer to a height above a top surface of said light emitting diode.

8. A light emitting device comprised of a light emitting diode on a mounting surface, said light emitting diode including a substrate layer comprised of silicon carbide and at least one active region, at least one resilient substantially transparent and substantially phosphor free polymer layer extending from said mounting surface to above at least one quarter of a height of the substrate layer and below a top surface of the light emitting diode, at least a second layer containing phosphor extending from said phosphor free polymer layer to a height above a top surface of said light emitting diode, and said phosphor is selected from TAG:Ce, YAG:Ce and mixtures or derivatives thereof.

9. A method of manufacturing a light emitting device comprising mounting a light emitting diode on a surface, said light emitting diode having a substrate layer and at least one active region, providing an electrical connection to said light emitting diode, depositing a substantially transparent and substantially phosphor free polymer adjacent said mounting surface to a height between above at least one quarter of a height of the substrate layer and just below the active region of the light emitting diode, and depositing at least a second layer containing phosphor disposed in a carrier material on said phosphor free polymer layer to above a top surface of said light emitting diode.

10. The method of claim 9 wherein said substrate layer is comprised of SiC.

11. The method of claim 9 wherein said mounting surface comprises a curved reflector.

12. The method of claim 9 wherein said polymer and said carrier material are selected from silicone, epoxy or hybrids thereof.

13. The method of claim 9 wherein said carrier material is selected from silicone, epoxy, or hybrid thereof or volatile organic liquids or semi-liquids or mixtures thereof.

14. The method of claim 9 wherein said substrate has a height of at least 150 μm.

15. The method of claim 9 wherein said active region includes at least gallium and nitride.

16. The method of claim 9 wherein said LED emits light between 360 and 420 nanometers.

17. The method, of claim 9 further comprising depositing an encapsulant layer above said phosphor containing carrier material.

18. The method of claim 9 wherein said phosphor free polymer is least partially cured before depositing said carrier material.

19. A light emitting device comprised of a light emitting diode on a mounting surface, said light emitting diode including a substrate layer, a substantially transparent and substantially phosphor free polymer layer extending from said mounting surface to above at least one quarter of a height of the substrate layer and just below the active region of the light emitting diode, and a phosphor containing layer extending from said phosphor free polymer layer to a height above the top surface of said light emitting diode.

20. The light emitting device of claim 4 wherein said mounting surface comprises a curved reflector.

21. The light emitting device of claim 4 wherein said polymer is selected from silicone, epoxy or hybrids thereof.

22. The light emitting device of claim 4 wherein said material containing said phosphor is selected from silicone, epoxy, or hybrid thereof, or volatile organic liquids or semi-liquids.

23. The light emitting device of claim 4 wherein said active region comprises at least gallium and nitride.

24. The light emitting device of claim 4 wherein said light emitting diode emits lights between 360 and 420 nanometers.

25. The light emitting device of claim 4 further comprising an encapsulant layer.

26. The light emitting device of claim 4 wherein said phosphor is selected from TAG:Ce, YAG:Ce and mixtures or derivatives thereof.