Power semiconductor device having RESURF layer
A semiconductor device including a drain layer having a first conductivity type, a drift layer having the first conductivity type, which is formed on the drain layer and has an impurity concentration lower than that in the drain layer, and a RESURF layer having a second conductivity type and formed to extend from a surface of the drift layer into the drain layer, the RESURF layer forming a superjunction structure together with the drift layer and forming a depletion layer in the drift layer.
1. A semiconductor device comprising:
a drain layer having a first conductivity type;
a drift layer having the first conductivity type, which is formed on the drain layer and has an impurity concentration lower than that in the drain layer;
a RESURF layer having a second conductivity type and formed to extend from a surface of the drift layer into the drain layer, the RESURF layer forming a superjunction structure together with the drift layer and forming a depletion layer in the drift layer; and
one of a first insulating film and first semiconductor layer formed to extend from a surface of the RESURF layer to the drain layer, the first semiconductor layer having an impurity concentration lower than those in the drift layer and RESURF layer, the RESURF layer being located between the drain layer and one of the first insulating film and first semiconductor layer and between the drift layer and one of the first insulating film and first semiconductor layer.
2. The device according to claim 1 , further comprising:
a base layer having the second conductivity type and formed in surface regions of the drift layer and RESURF layer;
a source layer having the first conductivity type and formed in a surface region of the base layer; and
a gate electrode formed on the base layer between the drift layer and the source layer with a gate insulating film interposed therebetween.
3. The device according to claim 2 , further comprising a second semiconductor layer having the first conductivity type, which is formed between the RESURF layer and the drain layer and between the RESURF layer and the drift layer and has an impurity concentration higher than that in the drift layer.
4. The device according to claim 2 , wherein a bottom surface of the RESURF layer is located at a position deeper than a bottom surface of the drift layer.
5. The device according to claim 2 , wherein
the RESURF layer has a planar pattern with a stripe shape in a first direction along the gate electrode in an element region where a semiconductor element is present,
a plurality of RESURF layers are formed at an element terminating portion in a second direction perpendicular to the first direction, and
the plurality of RESURF layers at the element terminating portion are electrically connected.