IP Library › Granted Patent US 6,921,865
Granted Patent B2
US 6,921,865 · App. 10/083,504 · Granted Jul 26, 2005

Superconductor connection structure

Assignee: Hitachi, Ltd.
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Quick Facts
Patent No.
US 6,921,865
App. No.
10/083,504
Granted
Jul 26, 2005
Kind
B2
Abstract

Electrical connection of superconducting lines can be achieved by using a low-melting point metal, by mechanical contact of superconducting lines or by welding. According to these methods, however, critical current and critical magnetic field at the connection point are low, and stable connection in a superconducting state has been difficult. The present invention solves these problems and provides a structure and method for connecting superconducting lines. The present invention provides high-performance, high-stability connection of superconducting lines through magnesium diboride (MgB 2 ) powder arranged between superconducting lines.

Claims (12)

1. A superconducting line connection structure for connecting two or more superconducting lines, wherein the superconducting line connection structure comprises superconductor powder comprising magnesium diboride present between said superconducting lines, and wherein a superconducting filament enclosed in each said superconducting line is directly in contact with said superconducting powder at least on some portion of the contact surface between said superconducting line and said superconducting powder.

2. A superconducting line connection structure according to claim 1 , further comprising a metal powder or an alloy powder in a mixture with the superconducting powder between said superconducting lines.

3. A superconducting line structure according to claim 2 , wherein the metal powder or alloy powder has a melting point lower than the superconducting powder.

4. A superconducting line connection structure according to claim 2 , wherein said superconducting lines and the mixture of superconducting powder and metal powder or alloy powder are enclosed in a coating material made of a pure metal of gold, silver, copper, platinum, palladium, aluminum, niobium, lead, tin, magnesium, indium, tungsten, cobalt, nickel, iron, tantalum or chromium, or an alloy containing at least one of said metals.

5. A superconducting line connection structure according to claim 1 , wherein the average particle size of said superconducting powder is 20 microns or less.

6. A superconducting line connection structure according to claim 1 , wherein said superconducting lines and said superconducting powder are enclosed in a coating material made of a pure metal of gold, silver, copper, platinum, palladium, aluminum, niobium, lead, tin, magnesium, indium, tungsten, cobalt, nickel, iron, tantalum or chromium, or an alloy containing at least one of said metals.

7. A superconducting line connection structure according to claim 1 , wherein the density of said superconducting powder is 50% or more of theoretical density.

8. A superconducting magnet apparatus comprising a superconducting line connection structure according to claim 1 .

9. A superconducting line comprising a superconducting line connection structure according to claim 1 .

10. A superconducting line connection structure for connecting two or more superconducting lines, wherein the superconducting line connection structure comprises superconductor powder comprising magnesium diboride present between the superconducting lines, and wherein the each superconducting line to be connected is a superconducting stranded wire formed by twisting multiple superconducting lines.

11. A superconducting line connection structure according to claim 10 , characterized in that said superconducting stranded wire is a superconducting stranded wire inside a cable-in-conduit type forcibly cooled superconductor.

12. A superconducting magnet apparatus comprising a superconducting line connection structure manufactured by intervening superconducting powder comprising magnesium diboride between at least two superconducting lines, wherein heat treatment of said electrical connection structure is not conducted.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2002
From: MORITA, HIROSHI; TANAKA, KAZUHIDE; SUZUKI, YASUO; OKADA, MICHIYA
To: HITACHI, LTD.
Reel/Frame 012649/0973 →
Priority Claims (1)
JP 2001-208675 · Jul 10, 2001 · national
Continuity (1)
Related Publication 20030051901A1 · Mar 20, 2003