Apparatus and method for wafer backside inspection
An automatic wafer backside inspection may automatically inspect a backside of a semiconductor wafer to look for contamination, cracks, scratches and the like. An inspection apparatus may comprise a wafer cassette with slots to hold a plurality of wafers. A wafer transfer arm may be located near the wafer cassette. A wafer flip/aligner may be operable to flip and align wafers. A wafer inspecting unit may be located adjacent the wafer flip/aligner and be operable to inspect the backside of wafers flipped by the flipper aligner. A wafer buffer stage may be located between the wafer cassette and the wafer flip/aligner for temporarily holding a wafer. The wafer transfer arm may transfer wafers to/from or amongst at least two of the wafer cassette, the wafer flip/aligner, the wafer inspection unit and the wafer buffer stage.
1. An apparatus for wafer backside inspection comprising:
a wafer cassette to contain a plurality of wafers;
a wafer transfer arm located near the wafer cassette, the wafer transfer arm operable to transfer a wafer;
a wafer flip/aligner near the wafer transfer arm, the wafer flip/aligner operable to flip and align a wafer;
a wafer inspecting unit disposed adjacent to the wafer flip/aligner and near the wafer transfer arm, the wafer inspecting unit operable to inspect a backside of a wafer; and
a wafer buffer stage disposed between the wafer cassette and the wafer flip/aligner for temporarily holding a wafer before the wafer being refined by the flip/aligner.
2. The apparatus of claim 1 , in which the wafer flip/aligner comprises:
a wafer table operable to support and align a wafer; and
a rotator operable to grip a wafer on the wafer table, displace the wafer relative to the wafer table and flip the wafer.
3. The apparatus of claim 2 , in which the wafer table comprises:
a table body;
a rotational plate comprising a surface to seat and rotate a wafer over the table body; and
a sensor to detect a predetermined radial orientation of the wafer on the rotational plate;
the table body further operable to fix the rotational position of the rotational plate responsive to the sensor detecting the predetermined radial orientation.
4. The apparatus of claim 3 , in which the sensor is operable to detect a flat zone or a notch along a peripheral edge of the wafer.
5. The apparatus of claim 3 , in which the table body is selectably operable to spin the rotational plate about an axis normal to a wafer's surface.
6. The apparatus of claim 3 , in which the rotator comprises:
a gripper to grip the periphery of the wafer;
an inverting arm comprising one end secured to the gripper, the inverting arm rotationally operable to turn-over the gripper and the wafer gripped therein; and
a moving guide connected to the other end of the inverting arm, the moving guide operable to displace the inverting arm relative to the wafer table.
7. The apparatus of claim 6 , in which the moving guide is operable to vertically displace the gripper relative the wafer table to a height greater than the rotation radius of the gripper.
8. The apparatus of claim 1 , the wafer transfer arm operable to transfer wafers from/to any two of the group consisting of at least the wafer cassette, wafer flip/aligner and wafer inspecting unit.
9. The apparatus of claim 1 , in which the wafer inspecting unit comprises:
a wafer stage to support a wafer; and
a vision module to inspect a surface of the wafer on the wafer stage.
10. The apparatus of claim 9 , in which the vision module comprises:
an inspecting camera disposed with its line of sight directed at an angle relative to the surface of the wafer;
a focus camera disposed near the inspecting camera to assist focusing of the inspecting camera; and
a monitor camera disposed between the inspecting camera and the focus camera to monitor the surface of the wafer.
11. The apparatus of claim 10 , in which the inspecting camera is disposed with its line of sight directed toward the surface of the wafer to define an acute angle relative thereto.
12. The apparatus of claim 1 , further comprising a defective wafer cassette beside the wafer cassette for receiving defective wafers which fail the backside inspection.
13. A method of inspecting a backside of a wafer, comprising:
retrieving a first wafer from a wafer cassette;
transferring a first wafer retrieved by the retrieving to a wafer flip/aligner;
flipping and aligning the first wafer transferred to the wafer flip/aligner and facing a backside of the first wafer upwardly;
after flipping, transferring the first wafer flipped by the flipping to a wafer inspection unit;
inspecting the backside of the first wafer using the wafer inspection unit;
after inspecting, transferring the first wafer to a wafer buffer stage to temporarily hold the first wafer before re-flipping thereof;
after transferring the first wafer to the wafer buffer stage, transferring the first wafer to the wafer flip/aligner; and
re-flipping the first wafer and facing the backside of the first wafer downwardly.
14. The method according to claim 13 , further comprising:
analyzing results of the inspecting; and
sorting the first wafer based upon the analysis of the results.
15. The method of claim 14 , further comprising:
during at least a portion of the inspecting the backside of the first wafer,
retrieving a second wafer from the wafer cassette,
transferring the second wafer to the wafer flip/aligner, and
flipping the second wafer to face a backside of the second wafer upwardly.
16. The method of claim 15 , further comprising:
during at least a portion of the holding the first wafer on the wafer buffer stage, transferring the second wafer from the wafer flip/aligner to the wafer inspecting unit; and
inspecting the backside of the second wafer using the wafer inspecting unit.
17. The method of claim 16 , further comprising:
during at least a portion of the inspecting of the second wafer, transferring a third wafer from the wafer cassette to the wafer flip/aligner, and
flipping the third wafer to face a backside of the third wafer upwardly.
18. The method of claim 17 , in which the sorting of the first wafer is performed during at lead a portion of the inspecting of the second wafer.
19. The method according to claim 14 , in which the sorting is performed after the re-flipping.
20. The method according to claim 13 , in which the retrieving the first wafer comprises retrieving a wafer from one of a plurality of wafer positions of the wafer cassette.
21. The method of claim 13 , in which the transferring and flipping comprise:
using a wafer transfer arm to obtain the first wafer from the wafer cassette and transfer the first wafer to a wafer table of the wafer flip/aligner;
using a gripper to grip the periphery of the first wafer transferred onto the wafer table;
displacing the gripper and the first wafer gripped therein relative to the wafer table;
rotating the gripper and turning the first wafer upside down; and
placing the overturned first wafer on the wafer table.
22. The method of claim 21 , in which the displacing comprises moving the gripper upwardly.
23. The method according to claim 21 , further comprising aligning the first wafer on the wafer table.
24. The method according to claim 23 , in which the aligning comprises locating a mark of the first wafer at a predetermined radial position thereof.
25. The method of claim 23 , in which the aligning comprises sensing and identifying one of a flat zone or notch along a peripheral edge of the first wafer.