Method of manufacturing thin film piezoelectric elements
A method for making thin film piezoelectric elements including forming a flat-plate laminate by laminating a first electrode layer, a piezoelectric thin film, and a second electrode layer, on one surface of an element forming substrate, and forming on the one surface a plurality of thin film piezoelectric elements including connecting electrodes for electrically connecting the first electrode layer and the second electrode layer to external equipment, including forming the element holding layer including resin over the one surface of the substrate including the thin film piezoelectric elements; bonding the one surface of the substrate, opposed to a temporary fixing substrate and covered with the element holding layer, on the temporary fixing substrate by using a fixing resin; covering a peripheral area with a specified width; and removing the element forming substrate by etching in an area other than the area covered with the fixing resin, and separating the thin film piezoelectric elements held by the element holding layer, into individually separate elements or groups of elements.
1. A manufacturing method for thin film piezoelectric elements, comprising:
forming a flat-plate laminate by sequentially laminating a first electrode layer, a piezoelectric thin film, and a second electrode layer, on one surface of an element forming substrate, and forming on said one surface of said element forming substrate a plurality of thin film piezoelectric elements comprising connecting electrodes for electrically connecting said first electrode layer and said second electrode layer to external equipment;
forming said element holding layer comprising resin over the one surface of said element forming substrate including said thin film piezoelectric elements;
bonding the one surface of said element forming substrate, opposed to a temporary fixing substrate and covered with said element holding layer, on said temporary fixing substrate by using a fixing resin;
covering a peripheral area with a specified width from a peripheral portion opposite to the one surface of said element forming substrate and a peripheral end portion of said element forming substrate with said fixing resin; and
removing said element forming substrate by etching in an area other than the area covered with said fixing resin thereby holding said thin film piezoelectric elements by said element holding layer; and
separating said thin film piezoelectric elements held by said element holding layer into individually separated elements or groups of elements.
2. The manufacturing method for thin film piezoelectric elements of claim 1 , wherein
forming said element holding layer comprises applying organic resin to said element forming substrate and thin film piezoelectric element surfaces, followed by dry hardening said element holding layer.
3. The manufacturing method for thin film piezoelectric elements of claim 1 , wherein
said element holding layer is formed by plasma polymerization reaction.
4. The manufacturing method for thin film piezoelectric elements of claim 1 , wherein
forming said element holding layer comprises spin coating of organic resin to said element forming substrate and thin film piezoelectric element surfaces.
5. The manufacturing method for thin film piezoelectric elements of claim 1 , wherein
the thickness of said element holding layer is substantially 2 to 5 μm.
6. The manufacturing method for thin film piezoelectric elements of claim 1 , wherein
forming the flat-plate laminate comprises forming a two-layer laminate comprising two assemblies, wherein second electrode layers of each of said assemblies face each other.