IP Library › Granted Patent US 6,950,575
Granted Patent B2
US 6,950,575 · App. 10/463,596 · Granted Sep 27, 2005

Optical module and a method for manufacturing an optical module

Assignee: Avanex Corporation
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Quick Facts
Patent No.
US 6,950,575
App. No.
10/463,596
Filed
Jun 18, 2003
Granted
Sep 27, 2005
Kind
B2
Art Unit
2872
USPC
385/33
Abstract

The invention is a method for manufacturing an optical module where on forms a groove in a substrate for positioning a component such as an optical component. The optical component is provided to be bonded into the groove by a aluminum oxide bonding process. To prepare the bonding an aluminum layer is deposited on the optical component followed by a protection layer.

Claims (35)

1. A method for manufacturing an optical module comprising the steps:

providing a place on a substrate for positioning an optical component,

providing the optical component,

bonding the optical component to the groove by means of aluminum oxide bonding process,

wherein the process is modified by forming an aluminum layer on the optical component,

protecting the aluminum layer with a protection layer.

2. A method for manufacturing an optical module comprising the steps:

providing a place on a substrate for positioning an optical component,

providing the optical component,

bonding the optical component to the place by means of aluminum oxide bonding process,

wherein the process is modified by

forming an aluminum layer on the substrate,

protecting the aluminum layer with a protection layer.

3. A method according to claim 2 where the optical component has a silicon oxide coating.

4. A method according to claim 2 where the aluminum layer is doped with at least one dopant.

5. A method according to claim 2 where the protection layer consists of silicon.

6. A method according to claim 2 where the protection layer consists of polymer.

7. A method according to claim 1 where the substrate has a silicon oxide coating at least at the fixation section.

8. A method according to claim 1 where the aluminium layer is doped with at least one dopant.

9. A method according to claim 1 where the protection layer consists of silicon.

10. A method according to claim 1 where the protection layer consists of polymer.

11. An optical module comprising,

a substrate with a groove,

an optical component being aluminum oxide bonded to a place on a substrate,

an aluminum layer being formed on the optical component,

a protection layer formed on the optical component and covering at least a portion of the aluminum layer to reduce the oxidation of the aluminum layer.

12. An optical module according to claim 11 where the protection layer consists of silicon.

13. An optical module according to claim 11 where the protection layer consists of a polymer.

14. An optical module comprising,

a substrate with a groove,

an optical component being aluminum oxide bonded to a place on a substrate,

an aluminum layer being formed on the substrate,

a protection layer formed on the the substrate and covering at least a portion of the aluminum layer to reduce the oxidation of the aluminum layer.

15. An optical module according to claim 14 where the protection layer consists of silicon.

16. An optical module according to claim 14 where the protection layer consists of a polymer.

Assignments (10)
CHANGE OF NAME Recorded Jul 17, 2019
From: OCLARO, INC.
To: LUMENTUM OPTICS INC.
Reel/Frame 049783/0733 →
RELEASE OF SECURITY INTEREST Recorded May 9, 2017
From: SILICON VALLEY BANK
To: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
Reel/Frame 042430/0235 →
CHANGE OF NAME Recorded May 5, 2014
From: AVANEX CORPORATION
To: OCLARO (NORTH AMERICA), INC.
Reel/Frame 032826/0276 →
RELEASE OF SECURITY INTEREST Recorded Apr 9, 2014
From: WELLS FARGO CAPITAL FINANCE, LLC
To: OCLARO (NORTH AMERICA), INC.
Reel/Frame 032643/0427 →
SECURITY INTEREST Recorded Apr 2, 2014
From: OCLARO, INC.; OCLARO TECHNOLOGY, INC.; OCLARO (NORTH AMERICA), INC.; MINTERA CORPORATION; OPNEXT, INC.; PINE PHOTONICS COMMUNICATIONS, INC.; OPNEXT SUBSYSTEMS INC.; BOOKHAM NOMINEES LIMITED; OCLARO TECHNOLOGY LIMITED; OCLARO INNOVATIONS LLP
To: SILICON VALLEY BANK
Reel/Frame 032589/0948 →
PATENT SECURITY AGREEMENT Recorded Jul 12, 2012
From: OCLARO (NORTH AMERICA), INC.
To: WELLS FARGO CAPITAL FINANCE, INC., AS AGENT
Reel/Frame 028540/0254 →
RELEASE OF SECURITY INTEREST Recorded Mar 20, 2007
From: HBK INVESTMENTS, L.P.
To: AVANEX CORPORATION
Reel/Frame 019035/0342 →
SECURITY AGREEMENT Recorded May 27, 2005
From: AVANEX CORPORATION
To: HBK INVESTMENTS L.P.
Reel/Frame 016079/0174 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2003
From: ALCATEL
To: AVANEX CORPORATION
Reel/Frame 013967/0556 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2003
From: KARLA, INGO
To: ALCATEL
Reel/Frame 014202/0745 →
Priority Claims (1)
EP 02360181 · Jun 19, 2002 · regional
Continuity (1)
Related Publication 20040057679A1 · Mar 25, 2004