IP Library › Granted Patent US 6,969,629
Granted Patent B2
US 6,969,629 · App. 10/791,903 · Granted Nov 29, 2005

Method for manufacturing micro-structural unit

Assignees: Fujitsu Limited; Fujitsu Media Devices Limited
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Quick Facts
Patent No.
US 6,969,629
App. No.
10/791,903
Granted
Nov 29, 2005
Kind
B2
Abstract

A method for manufacturing a micro-structural unit is provided. By the method, micro-machining is performed on a material substrate including first through third conductive layers and two insulating layers, one of which is interposed between the first and the second conductive layers, and the other between the second and the third conductive layers. The method includes several etching steps performed on the layers of the material substrate that are different in thickness.

Claims (30)

1. A method for manufacturing a micro-structural unit by performing machining on a material substrate which has a laminated structure comprising a first conductive layer, a second conductive layer, a third conductive layer, a first insulating layer interposed between the first conductive layer and the second conductive layer, and a second insulating layer interposed between the second conductive layer and the third conductive layer, the method comprising:

a first etching step for performing an etching treatment on the first conductive layer to an intermediate point in a direction of thickness of the first conductive layer via a first mask pattern and a second mask pattern formed on the first conductive layer;

a step for removing the second mask pattern;

a second etching step for performing an etching treatment on the first conductive layer via the first mask pattern until the first insulating layer is reached, so that residual mask parts that contact the first insulating layer are left;

a third etching step for performing an etching treatment via the residual mask parts on portions of the first insulating layer that are exposed in the second etching step until the second conductive layer is reached; and

a fourth etching step for removing the residual mask parts by etching, and for performing an etching treatment on portions of the second conductive layer that are exposed in the third etching step.

2. The method according to claim 1 , wherein in the fourth etching step, the etching treatment performed on the exposed portions of the second conductive layer is continued until the second insulating layer is reached.

3. The method according to claim 1 , further comprising a fifth etching step for performing an etching treatment on the third conductive layer via a third mask pattern formed on the third conductive layer, the etching treatment on the third conductive layer being continued until the second insulating layer is reached.

4. The method according to claim 2 , wherein: the first mask pattern comprises mask parts for a comb tooth-shaped electrode;

first conductive parts of the comb tooth-shaped electrode are formed in the first conductive layer in the second etching step;

insulating parts of the comb tooth-shaped electrode are formed in the first insulating layer in the third etching step; and

second conductive parts of the comb tooth-shaped electrode are formed in the second conductive layer in the fourth etching step.

5. The method according to claim 3 , wherein:

the third mask pattern comprises first mask parts for a comb tooth-shaped electrode;

the second mask pattern comprises second mask parts for the comb tooth-shaped electrode;

first conductive parts of the comb tooth-shaped electrode are formed in the third conductive layer in the fifth etching step;

residual mask parts for the comb tooth-shaped electrode are formed in the first conductive layer in the second etching step; and

second conductive parts of the comb tooth-shaped electrode are formed in the second conductive layer, and the residual mask parts are removed by etching, in the fourth etching step;

the method further comprising a sixth etching step for forming insulating parts of the comb tooth-shaped electrode in the second insulating layer, the insulating parts being interposed between the first conductive parts and the second conductive parts.

6. The method according to claim 3 , wherein:

the third mask pattern comprises first mask parts for a first comb tooth-shaped electrode;

the second mask pattern comprises second mask parts for the first comb tooth-shaped electrode;

the first mask pattern comprises mask parts for a second comb tooth-shaped electrode;

first conductive parts of the first comb tooth-shaped electrode are formed in the third conductive layer in the fifth etching step;

residual mask parts for the first comb tooth-shaped electrode and first conductive parts of the second comb tooth-shaped electrode are formed in the first conductive layer in the second etching step;

insulating parts of the second comb tooth-shaped electrode are formed in the first insulating layer in the third etching step; and

second conductive parts of the first comb tooth-shaped electrode and second conductive parts of the second comb tooth-shaped electrode are formed in the second conductive layer, and the residual mask parts for the first comb tooth-shaped electrode are removed by etching, in the fourth etching step;

the method further comprising a sixth etching step for forming insulating parts of the first comb tooth-shaped electrode in the second insulating layer, the insulating parts being interposed between the first and second conductive parts of the first comb tooth-shaped electrode.

7. The method according to claim 1 , further comprising a step for forming a first conductive connecting part that passes through the first insulating layer and electrically connect the first conductive layer and the second conductive layer, and/or a step for forming a second conductive connecting part that passes through the second insulating layer and electrically connect the third conductive layer and the second conductive layer.

8. The method according to claim 4 , further comprising a step for forming a first conductive connecting part that passes through the first insulating layer and electrically connect respective conductive parts in each comb tooth-shaped electrode, and/or a step for forming a second conductive connecting part that passes through the second insulating layer and electrically connect respective conductive parts in each comb tooth-shaped electrode.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 25, 2006
From: FUJITSU MEDIA DEVICES LIMITED
To: FUJITSU LIMITED
Reel/Frame 018433/0132 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2004
From: KOUMA, NORINAO; TSUBOI, OSAMU; OKUDA, HISAO; SONEDA, HIROMITSU; MI, XIAOYU; UEDA, SATOSHI; SAWAKI, IPPEI; NAKAMURA, YOSHITAKA
To: FUJITSU LIMITED; FUJITSU MEDIA DEVICES LIMITED
Reel/Frame 015047/0993 →
Priority Claims (2)
JP 2003-292555 · Aug 12, 2003 · national
JP 2003-407838 · Dec 5, 2003 · national
Continuity (1)
Related Publication 20050037531A1 · Feb 17, 2005