Method and apparatus for monitoring a metal layer during chemical mechanical polishing
A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.
1. A polishing system, comprising:
a polishing pad having a polishing surface, a bottom surface, a cover layer, and a backing layer, the polishing pad including a recess formed in the bottom surface, wherein the recess includes an aperture formed in the backing layer, and wherein the recess includes an indentation formed in a bottom surface of cover layer and aligned with the aperture in the backing layer;
a carrier operable to hold a substrate against the polishing surface of the polishing pad;
a motor operable to cause relative motion between the polishing pad and the substrate; and
an eddy current monitoring system including a ferromagnetic body positioned on a side of the polishing surface opposite the substrate, the ferromagnetic body extending into the recess and at least partially through the polishing pad, the eddy current monitoring system being operable to monitor a magnetic field using an induction coil that is magnetically coupled to the ferromagnetic body.
2. The polishing system of claim 1 , wherein a plug is secured in the cover layer and is aligned with the aperture in the backing layer.
3. The polishing system of claim 2 , wherein the plug is formed of a different material than the cover layer.
4. The polishing system of claim 2 , wherein the plug is a polymer.
5. The polishing system of claim 4 , wherein the plug is a polyurethane.
6. The polishing system of claim 2 , wherein the plug is non-magnetic and non-conductive.
7. The polishing system of claim 1 , wherein the polishing pad is attached to a platen, and the ferromagnetic body is supported by the platen.
8. The polishing system of claim 1 , further comprising a coil wound around the ferromagnetic body.
9. The polishing system of claim 1 , wherein the ferromagnetic body is U-shaped.
10. A method of polishing, comprising:
bringing a substrate into contact with a polishing surface of a polishing pad that includes a recess formed in a bottom surface thereof, a cover layer, and a backing layer, wherein the recess includes an aperture formed in the backing layer, and wherein the recess includes an indentation formed in a bottom surface of cover layer and aligned with the aperture in the backing layer;
positioning a ferromagnetic body on a side of the polishing surface opposite the substrate so that the ferromagnetic body extends into the recess and at least partially through the polishing pad;
causing relative motion between the substrate and the polishing pad; and
monitoring a magnetic field using an induction coil that is magnetically coupled to the ferromagnetic body.
11. The method of claim 10 , wherein a plug is secured in the cover layer and is aligned with the aperture in the backing layer.
12. The method of claim 11 , wherein the cover layer is formed of a first material and the plug is formed of a second material that is different from the first material.
13. The method of claim 11 , wherein the plug is a polymer.
14. The method of claim 11 , wherein the plug is a polyurethane.
15. The method of claim 11 , wherein the plug is non-magnetic and non-conductive.
16. The method of claim 10 , wherein the polishing pad is attached to a platen, and the ferromagnetic body is supported by the platen.
17. The method of claim 10 , wherein a coil is wound around the ferromagnetic body.
18. The method of claim 10 , wherein the ferromagnetic body is U-shaped.