Heat selective electrically conductive polymer sheet
Disclosed is an article comprising first areas of electrically conductive material and second areas of electrically conductive material raised relative to the first areas and substantially electrically isolated from the first areas, said conductive materials exhibiting a resistivity that averages less than 800 ohm/square.
1. An article suitable for forming thereon a desired electrically conductive pattern by imagewise application of heat and/or pressure comprising a plurality of elevated areas of electrically conductive material deposited on thermoplastic polymer pillars wherein the conductive material exhibits a resistivity that averages less than 800 ohm/square, the resistivity between adjacent elevated areas averages greater than 2000 ohm/square, and wherein said polymer pillars have a Tg less than 80 degrees Celsius.
2. The article of claim 1 wherein the resistivity of said electrically conductive materials averages less than 300ohms/square.
3. The article of claim 1 wherein the resistivity of said electrically conductive materials average less than 10 ohms/square.
4. The article of claim 1 wherein said article has a light transmission greater than 85%.
5. The article of claim 1 wherein the height of said pillars is between 5 and 100 micrometers.
6. The article of claim 1 wherein said conductive material comprises an electronically conductive polymer selected from the group consisting of substituted or unsubstituted aniline containing polymers, substituted or unsubstituted pyrrole containing polymers, substituted or unsubstituted thiophene containing polymers.
7. The article of claim 6 wherein said electronically conductive polymer is selected from the group consisting of poly(3,4-ethylene dioxythiophene styrene sulfonate), poly(pyrrole styrene sulfonate) and poly(3,4-ethylene dioxypyrrole styrene sulfonate).
8. The article of claim 1 comprising a first area and a second area of conductive materials raised above the first area, wherein at least one of said conductive materials comprises metal.
9. The article of claim 1 wherein said first area of electrically conductive material further comprises a polymer protective overcoat.
10. The article of claim 1 wherein said polymer pillars have a height between 5 and 100 micrometers.
11. The article of claim 1 wherein said conductive material comprises an electronically conductive polymer selected from the group consisting of substituted or unsubstituted aniline containing polymers, substituted or unsubstituted pyrrole containing polymers, substituted or unsubstituted thiophene containing polymers.
12. The article of claim 11 wherein said electronically conductive polymer is selected from the group consisting of poly(3,4-ethylene dioxythiophene styrene sulfonate), poly(pyrrole styrene sulfonate) and poly(3,4-ethylene dioxypyrrole styrene sulfonate).
13. The article of claim 1 wherein at least one of said conductive materials comprises metal.
14. The article of claim 1 wherein conductive material is present between said polymer pillars.
15. The article of claim 1 wherein each of said polymer pillars has a diameter of between 1 and 100 micrometers.
16. The article of claim 1 wherein each of said pillars is triangular in shape.
17. The article of claim 1 wherein the top of said pillars is concave or convex.
18. The article of claim 1 wherein said article has a light transmission greater than 85%.
19. The article of claim 1 wherein the aspect ratio of said pillars is between 0.8 and 5.0.
20. The article of claim 1 wherein the slope of the side of said pillar is between 70 and 90 degrees from the vertical.
21. The article of claim 1 wherein the first and second areas are viewable from a point above the article.
22. A process for creating an article with an electrically conductive area comprising providing an article comprising a plurality of elevated areas of electrically conductive material disposed on thermoplastic polymer pillars wherein the resistivity between adjacent areas averages greater than 2000 ohm/square and applying heat and/or pressure in a predetermined pattern to form desired areas of conductivity averaging less than 800 ohm/square, and wherein said polymer pillars have a Tg less than 80 degrees Celsius.
23. The process of claim 22 wherein said application of heat employs a thermal resistive head.
24. The process of claim 22 wherein said application of heat employs a laser.
25. The process of claim 22 wherein said application of heat employs a heated embossing roller or plate.
26. The process of claim 22 wherein said pattern comprises greater than 40 lines per cm.