Semiconductor processing apparatus having lift and tilt mechanism
A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear way comprising a fixed frame and a moveable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the moveable frame. The nest rotates between a wafer-horizontal orientation and a wafer-vertical orientation as it is driven with the movable frame by a motor that is coupled to the linear way. A lever connected to the nest provides an offset from true vertical for the nest when the nest is in the wafer-vertical orientation.
1. A lift/tilt assembly for use in a semiconductor wafer processing device, said lift/tilt assembly comprising:
a linear way comprising a fixed frame and a moveable frame;
a nest rotatably connected to said movable frame, said nest rotating between a wafer-horizontal orientation and a wafer-vertical orientation;
a motor coupled to said linear way; and
a lever connected to said nest, said lever providing an offset from true vertical for said nest when said nest is in said wafer-vertical orientation.
2. The lift/tilt assembly of claim 1 , further comprising a torsion spring assembly connected to said moveable frame, said torsion spring assembly comprising a torsion spring exerting a forcing bias against said nest.
3. The lift/tilt assembly of claim 1 , further comprising a nest motor connected to said moveable frame, said nest motor rigidly connected to said nest to produce rotation in said nest.
4. The lift/tilt assembly of claim 1 , further comprising a guide connected to said fixed frame and a ball bearing connected to said lever, said guide including a smooth surface over which said ball bearing may move.
5. The lift/tilt assembly of claim 4 , wherein said guide is a ramp.
6. The lift/tilt assembly of claim 1 , further comprising a linear encoder LED assembly mounted to said fixed frame and a linear encoder COD assembly mounted to said moveable frame.
7. The lift/tilt assembly of claim 1 , further comprising a tilt sensor connected to said nest and to said moveable frame.
8. The lift/tilt assembly of claim 1 , further comprising a H-bar sensor connected to said nest.
9. The lift/tilt assembly of claim 1 , further comprising a tube sensor connected to said moveable frame and a tube sensor receiver connected to said nest.
10. The lift/tilt assembly of claim 1 , further comprising a laser mapping unit comprising:
at least one transmitter;
at least one receiver;
said transmitter disposed to transmit energy through a wafer cassette located in said nest, and said receiver disposed to receive said energy transmitted by said transmitter.
11. The lift/tilt assembly of claim 1 , wherein said transmitter transmits optical energy and wherein said receiver receives optical energy.