Manufacturing method of solid-state image sensing device
View Patent ↗A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.
1. A method of manufacturing solid-stage image sensing device comprising the steps of:
(a) mounting electronic components on a first main surface of a wiring substrate;
(b) forming a sealing portion to seal said electronic components on said first main surface of said wiring substrate;
(c) mounting, after the step (b), image sensing elements on a second main surface in an opposite side of said first main surface of said wiring substrate;
(d) joining, after the step (b), a frame body on said second main surface of said wiring substrate covering said image sensing elements;
(e) adhering a protection film to said frame body after said step (d) but before said step (f);
(f) cuffing, after the step (d), said wiring substrate; and
(g) mounting, after the step (e), a lens holding portion comprising a lens within said frame body.
2. The method of manufacturing solid-state image sensing device according to claim 1 , further comprising the step of:
removing said protection film from said frame body after said step (f) but before said step (g).
3. The method of manufacturing solid-state image sensing device according to claim 1 , further comprising the step of: cutting, after the step (f), said wiring substrate; and removing said protection film from said frame body after the cutting step.
4. A method of manufacturing solid-state image sensing device comprising the steps of:
(a) mounting electronic components on a first main surface of a wiring substrate;
(b) forming a seal resin portion to seal said electronic components on said first main surface of said wiring substrate;
(c) forming a groove to said seal resin portion after said step (b);
(d) mounting, after said step (c), image sensing elements on a second main surface in an opposite side of said first main surface of said wiring substrate;
(e) joining, after the step (d), a frame body on said second main surface of said wiring substrate covering said image sensing elements; and
(f) adhering a protection film to said frame body after said step (e).
5. The method of manufacturing solid-state image sensing device according to claim 4 , wherein said groove is formed in said step (c) with half-dicing from said first main surface side of said wiring substrate.
6. The method of manufacturing semiconductor image sensing device according to claim 4 , wherein said wiring substrate includes a plurality of product regions, said seal resin portion is formed in said step (b) to simultaneously seal said electronic components in said plurality of product regions, and said groove is formed in said step (c) between said plurality of product regions.