Method for forming image on object surface including circuit substrate
By using a novel method, the exposure time of the photosensitive paste layer is reduced and the exposure fineness of the layer is improved, thereby developing a highly fine circuit substrate of high density having a thermal resistance at a reasonable cost. A circuit substrate is manufactured as follows. A photosensitive paste containing photoresist and a circuit material is applied onto a substrate surface so as to form a photosensitive paste layer ( 4 ). This photosensitive paste layer ( 4 ) is plotted by a laser beam ( 8 ) so as to form a plotted area ( 7 ). The photosensitive paste layer ( 4 ) is developed and an exposed area ( 4 a ) or an unexposed area ( 4 b ) is removed so as to form a circuit pattern ( 17 ). This circuit pattern ( 17 ) is sintered to form a circuit pattern ( 20 ) composed of the circuit material. It is possible to form a highly fine circuit pattern of high density by laser beam plotting. Moreover, when a greensheet ( 2 ) is used as the substrate, it is possible to form a ceramic substrate ( 18 ) having a thermal resistance by sintering. Furthermore, by using this method, it is possible to form an arbitrary image on an arbitrary object.
1. A method for manufacturing a circuit substrate comprising the steps of:
mixing a photoresist and a circuit material to form a photosensitive paste, applying said photosensitive paste to a surface of a substrate to form a photosensitive paste layer,
converging a laser beam emitted from a laser light source to focus a cross section of said laser beam to a dot size of dot pattern composing a circuit pattern, injecting said laser beam into a waveform shaping unit to convert said laser beam to a on-off beam corresponding to said dot pattern by computer signals, reflecting said on-off beam by a surface of a rotating polygon mirror, scanning continuously and repetitiously said on-off beam on a plotted area consisting of exposed and unexposed areas,
developing said photosensitive paste layer to form an unsintered circuit pattern by removing said exposed area or said unexposed area, and
sintering said unsintered circuit pattern to form a circuit pattern composed of said circuit material.
2. A method for manufacturing multilayer circuit substrate comprises the steps of:
mixing a photoresist and a circuit material to form a photosensitive paste,
applying said photosensitive paste to a surface of a substrate to form a photosensitive paste layer,
converging a laser beam emitted from a laser light source to focus a cross section of said laser beam to a dot size of dot pattern composing a circuit pattern, injecting said laser beam into a waveform shaping unit to covert said laser beam to an on-off beam corresponding to said dot pattern by computer signals, reflecting said on-off beam by a surface of a rotating polygon mirror, scanning continuously and repetitiously said on-off beam on a plotted area consisting of exposed and unexposed areas,
developing said photosensitive paste layer to form an unsintered circuit pattern by removing said exposed area or said unexposed area,
piling up a plurality of substrates formed said unsintered circuit pattern to form an unsintered multilayer circuit substrate, and
sintering said unsintered multilayer circuit patterns through sintering said unsintered multilayer circuit substrate to form a circuit pattern composed of said circuit material.
3. The method according to claim 2 , wherein one or more base holes are formed as located at outside of said plotted area on said substrate,
said plotted area is formed on said photosensitive paste layer with a predetermined location for said hole, and
said unsintered multilayer circuit substrate is formed by piling up a plurality of substrates in a state that all base holes are adjusted in a line up and down.
4. A method for forming an image on an object surface comprising the steps of:
mixing a photoresist and a colorant to form a photosensitive paste,
applying said photosensitive paste to a surface of an object to form a photosensitive paste layer,
converging a laser beam emitted from a laser light source to focus a cross section of said laser beam to a dot size of dot pattern composing an image pattern, injecting said laser beam into a waveform shaping unit to convert said laser beam to an on-off beam corresponding to said dot pattern by computer signals, reflecting said on-off beam by a surface of a rotating polygon mirror, scanning continuously and repetitiously said on-off beam on a plotted area consisting of exposed and unexposed areas, and
developing said photosensitive paste layer to form an unsintered image pattern by removing said exposed area or said unexposed area.