Method for manufacturing multilayer wiring board, and multilayer wiring board manufactured thereby

1. A method for manufacturing a multilayer wiring board having a laminar structure which includes an insulating layer and a wiring layer, the method comprising the steps of:

sticking a support, which has a surface treated with a coupling agent, onto the insulating layer with the coupling agent interposed therebetween;

transferring the coupling agent from the support to the insulating layer by removing the support while leaving the coupling agent on the insulating layer;

partially etching the insulating layer; and

forming a wiring pattern on the partially etched insulating layer onto which the coupling agent has been transferred.

2. A method for manufacturing a multilayer wiring board, comprising the steps of:

treating a surface of a support with a coupling agent;

forming an insulating layer on a surface of a substrate which is formed with a first wiring pattern;

sticking the support onto the insulating layer with the coupling agent interposed therebetween;

transferring the coupling agent to the insulating layer by removing the support while leaving the coupling agent on the insulating layer; and

forming a second wiring pattern on the insulating layer onto which the coupling agent has been transferred.

3. The method according to claim 2 , further comprising the steps of:

forming a via hole in the insulating layer onto which the coupling agent has been transferred; and

forming a via in the via hole along with forming a second wiring pattern on the insulating layer onto which the coupling agent has been transferred.

4. The method according to claim 3 , wherein the step of forming the second wiring pattern comprises the sub-steps of forming an electroless plating film on the insulating layer, forming a resist pattern on said electroless plating film, forming an electroplating film in the non-mask region of said resist pattern, removing the resist pattern, and removing the electroless plating film not covered by the electroplating film.

5. The method according to claim 2 , wherein the support is pressed onto the insulating layer in the step of sticking on the support.

6. The method according to claim 2 , wherein the step of sticking on the support is performed under heating.

7. The method according to claim 2 , wherein the support comprises a metal material selected from the group consisting of copper, aluminum, copper alloys, and aluminum alloys.

8. The method according to claim 2 , wherein the support has a surface roughness (maximum height roughness: R max ) of no more than 5 μm.

9. A method for manufacturing a multilayer wiring board having a laminar structure which includes an insulating layer and a wiring layer, the method comprising the steps of:

sticking a support, which is formed with a metal-containing bonding layer having an exposed surface treated with a coupling agent, onto the insulating layer with the coupling agent and the metal-containing bonding layer interposed therebetween;

transferring the coupling agent and the metal-containing bonding layer from the support to the insulating layer by removing the support while leaving the coupling agent and the metal-containing bonding layer on the insulating layer;

partially etching the insulating layer; and

forming a wiring pattern on the partially etched insulating layer onto which the coupling agent and the metal-containing bonding layer have been transferred.

10. A method for manufacturing a multilayer wiring board, comprising the steps of:

forming a metal-containing bonding layer on a support;

treating an exposed surface of the metal-containing bonding layer with a coupling agent;

forming an insulating layer on a surface of a substrate which is formed with a first wiring pattern;

sticking the support onto the insulating layer with the coupling agent and the metal-containing bonding layer interposed therebetween;

transferring the coupling agent and the metal-containing bonding layer to the insulating layer by removing the support while leaving the coupling agent and the metal-containing bonding layer on the insulating layer; and

forming a second wiring pattern on the metal-containing bonding layer.

11. The method according to claim 10 , further comprising the steps of:

forming a via hole in the insulating layer onto which the coupling agent and the metal-containing bonding layer have been transferred; and

forming a via in the via hole along with forming a second wiring pattern on the metal-containing bonding layer.

12. The method according to claim 11 , wherein the step of forming the second wiring pattern comprises the sub-steps of forming an electroless plating film on the metal-containing bonding layer, forming a resist pattern on said electroless plating film, forming an electroplating film in the non-mask region of said resist pattern, removing the resist pattern, and removing the electroless plating film not covered by the electroplating film.

13. The method according to claim 10 , wherein the metal-containing bonding layer comprises a metal compound containing a metal selected from the group consisting of chromium, copper, nickel, cobalt, and zinc.

14. The method according to claim 13 , wherein the metal compound is an oxide or a hydroxide of a metal selected from the group consisting of chromium, copper, nickel, cobalt, and zinc.

15. The method according to claim 10 , wherein the metal-containing bonding layer is provided in a coverage of at least 10% with respect to the insulating layer.

16. The method according to claim 10 , wherein the metal-containing bonding layer has a thickness of 0.01 to 1.0 μm.

17. The method according to claim 10 , wherein the support comprises a metal material selected from the group consisting of copper, aluminum, copper alloys, and aluminum alloys.

18. The method according to claim 10 , wherein the support has a surface roughness (maximum height roughness: R max ) of no more than 5 μm.