IP Library › Granted Patent US 7,020,956
Granted Patent B2
US 7,020,956 · App. 10/202,878 · Granted Apr 4, 2006

Method and apparatus for feeding components, and method and apparatus for mounting components

Assignee: Matsushita Electric Industrial Co., Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,020,956
App. No.
10/202,878
Granted
Apr 4, 2006
Kind
B2
Abstract

An occurrence of component lack at a component arrangement position, designated by a mounting program, of a component feed part, which feeds components to be mounted, is determined. Whether a spare component for the lacking component to be mounted is present in a spare component feed area of the component feed part is determined, and supply of the component to be mounted from a designated component arrangement position of the component feed part is switched to supply of the spare component from the spare component feed area.

Claims (10)

1. A component mounting method comprising:

performing an operation for detecting an occurrence of a lack of a component at a designated component arrangement position of a component feed part, from which designated component arrangement position the component was to have been supplied so as to have been mounted onto a printed circuit board, by a mounting head that is to mount components onto the printed circuit board in an order based on a mounting program, in accordance with a mounting cycle time based on the mounting program, wherein the component and the designated component arrangement position are designated by the mounting program;

when the occurrence of the lack of the component at the designated component arrangement position is detected, switching supply of the component from said designated component arrangement position to supply of a spare component from a component arrangement position other than said designated component arrangement position; and then

determining a mounting order in conformity with a component feed state for said spare component so as to not detrimentally increase the mounting cycle time by reorganizing, the order in which components are to be mounted onto the printed circuit board by said mounting head such that a distance that said mounting head is to move during mounting of the components onto the printed circuit board decreases, and thereby re-generating the mounting program.

2. The component mounting method according to claim 1 , wherein

reorganizing the order in which components are to be mounted onto the printed circuit board comprises reorganizing the order in which the components are to be mounted onto the printed circuit board when, not smaller than a predetermined value is a difference between a distance that said mounting head is to move during mounting of the components onto the printed circuit board prior to the switching and a distance that said mounting head is to move during mounting of the components onto the printed circuit board after the switching.

3. A component mounting method comprising:

performing an operation for detecting an occurrence of a lack of a component at a designated component arrangement position of a component feed part, from which designated component arrangement position the component was to have been supplied so as to have been mounted onto a printed circuit board, by a mounting head that is to mount components onto the printed circuit board in an order based on a mounting program, in accordance with a mounting cycle time based on the mounting program, wherein the component and the designated component arrangement position are designated by the mounting program;

when the occurrence of the lack of the component at the designated component arrangement position is detected, switching supply of the component from said designated component arrangement position to supply of a spare component from a component arrangement position other than said designated component arrangement position; and then

determining a mounting order in conformity with a component feed state for said spare component so as to not detrimentally increase the mounting cycle time by reorganizing the order in which components are to be mounted onto the printed circuit board by said mounting head when, not smaller than a predetermined value is a difference between a distance that said mounting head is to move during mounting of the components onto the printed circuit board prior to the switching and a distance that said mounting head is to move during mounting of the components onto the printed circuit board after the switching, and thereby re-generating the mounting program.

Priority Claims (1)
JP 10-262947 · Sep 17, 1998 · national
Continuity (2)
Division 0974334900
Related Publication 20020184747A1 · Dec 12, 2002