Rinse apparatus and method for wafer polisher
An apparatus for polishing a wafer comprising a rotatable polishing pad having a center of rotation and a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center. The rinse delivery conduit includes a plurality of nozzles to dispense a rinsing liquid. In one embodiment, the plurality of nozzles are configured and positioned to generate a higher flow rate of the rinsing liquid at the end of the rinse delivery conduit proximate to the center than at the end of the rinse delivery conduit distal to the center. In another embodiment, the rinse delivery conduit has a proximal end which is substantially adjacent the center and the distal end which is approximately adjacent an outer periphery of the pad.
1. An apparatus for polishing a wafer, comprising:
a rotatable polishing pad having a center axis of rotation;
a rinse delivery conduit positioned adjacent to the polishing pad and orientated in a direction substantially in radial alignment with the center axis;
the rinse delivery conduit including a plurality of nozzles to dispense a rinsing liquid;
the rinse delivery conduit having a proximal end and a distal end, the proximal end being substantially adjacent to the center axis and the distal end being approximately adjacent to an outer periphery of the pad; and
wherein the rinse delivery conduit is operable to move along the direction from a retracted position to an extended position to provide the rinsing liquid to an expanded area of the polishing pad, with the end of the rinse delivery conduit being adjacent to the center axis when in the extended position.
2. The apparatus according to claim 1 wherein the direction and the center axis are substantially perpendicular to each other.
3. An apparatus for polishing a wafer, comprising: a rotatable polishing pad having a center of rotation;
a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center;
the rinse delivery conduit including a plurality of nozzles to dispense a rinsing liquid;
the rinse delivery conduit having a proximal end and a distal end, the proximal end being substantially adjacent to the center and the distal end being approximately adjacent to an outer periphery of the pad;
wherein the rinse delivery conduit is operable to move from a retracted position to an extended position to provide the rinsing liquid, with the end of the rinse delivery conduit being adjacent to the center when in the extended position; and
wherein the rinse delivery conduit includes a first conduit having an open end facing the center and a second conduit having a dosed end facing the center and being disposed in a sliding relationship with the first conduit, the second conduit being in the extended position to provide the rinsing liquid and the retracted position when not providing the rinsing liquid, the first conduit including the plurality of nozzles and the second conduit including a plurality of fluid apertures.
4. An apparatus for polishing a wafer, comprising:
a rotatable polishing pad having a center of rotation;
a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center;
the rinse delivery conduit including a plurality of nozzles to dispense a rinsing liquid;
the rinse delivery conduit having a proximal end and a distal end, the proximal end being substantially adjacent to the center and the distal end being approximately adjacent to an outer periphery of the pad;
wherein the rinse delivery conduit is operable to move from a retracted position to an extended position to provide the rinsing liquid, with the end of the rinse delivery conduit being adjacent to the center when in the extended position; and
an rotary actuator and a pair of jointed extension arms extending from opposed sides of the rinse delivery conduit to the rotary actuator, wherein the rotary actuator is operable to rotate the ends of the jointed extension arms to cause the rinse delivery conduit to move from its retracted position to its extended position.