IP Library › Granted Patent US 7,038,213
Granted Patent B2
US 7,038,213 · App. 10/850,314 · Granted May 2, 2006

Composite active-matrix substrates, methods for manufacturing same, and electromagnetic wave capturing devices

Assignees: Shimadzu Corporation; Sharp Kabushiki Kaisha
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Quick Facts
Patent No.
US 7,038,213
App. No.
10/850,314
Granted
May 2, 2006
Kind
B2
Abstract

A composite active-matrix substrate includes: a plurality of active-matrix substrates which are disposed adjacent to one another; a base substrate which is disposed to oppose a bottom surface of the active-matrix substrates; a sealant which is disposed in the form of a frame between the active-matrix substrate and the base substrate; a first filler which fills a spacing surrounded by the active-matrix substrate, the base substrate, and the sealant; and a second filler which fills a gap between edges of the active-matrix substrates. The sealant prevents the first filler from seeping out. In this way, seeping of an adhesive filler can be prevented in the arrangement where a plurality of active-matrix substrates are fixed on the base substrate using the adhesive filler. An electromagnetic wave capturing device according to the present invention uses such a composite active-matrix substrate.

Claims (31)

1. A composite active-matrix substrate, comprising:

a plurality of active-matrix substrates, each having a top surface with an active element, which are disposed adjacent to one another so that the top surfaces of the active-matrix substrates make up a substantially level surface;

a base substrate, which is provided so as to oppose a bottom surface of the active-matrix substrates;

a gel sticking material as a first adhesive filler, which is provided to fill substantially a gap extending near a periphery of the active-matrix substrate between the bottom surface of each active-matrix substrate and the base substrate, for combining each active-matrix substrate with the base substrate; and

a second adhesive filler, which fills a gap between edges of the active-matrix substrates which are disposed adjacent to one another.

2. The composite active-matrix substrate as set forth in claim 1 , wherein the gel sticking material is a silicon gel.

3. The composite active-matrix substrate as set forth in claim 1 , wherein the second adhesive filler is an adhesive resin which is curable in the presence of air.

4. The composite active-matrix substrate as set forth in claim 1 , wherein the base substrate has no holes formed therethrough.

5. The composite active-matrix substrate as set forth in claim 1 , wherein the second adhesive filler fills the gap between edges of the active-matrix substrates to a level below the surface of the active-matrix substrates.

6. A composite active-matrix substrate, comprising:

a plurality of active-matrix substrates, each having a top surface with an active element, which are disposed adjacent to one another so that the top surfaces of the active-matrix substrates make up a substantially level surface;

a base substrate, which is provided so as to oppose a bottom surface of the active-matrix substrates;

a gel sticking material as a first adhesive filler, which is provided between the bottom surface of each active-matrix substrate and the base substrate, for combining each active-matrix substrate with the base substrate;

a second adhesive filler, which fills a gap between edges of the active-matrix substrates which are disposed adjacent to one another; and

a sealant, which is provided so as to surround the gel sticking material.

7. An electromagnetic wave capturing device, comprising:

(I) a composite active-matrix substrate which is provided with:

a plurality of active-matrix substrates, each having a top surface with an active element, which are disposed adjacent to one another so that the top surfaces of the active-matrix substrates make up a substantially level surface;

a base substrate, which is provided so as to oppose a bottom surface of the active-matrix substrates;

a gel sticking material as a first adhesive filler, which is provided to fill substantially a gap extending near a periphery of the active-matrix substrate between the bottom surface of each active-matrix substrate and the base substrate, for combining each active-matrix substrate with the base substrate; and

a second adhesive filler, which fills a gap between edges of the active-matrix substrates which are disposed adjacent to one another;

(II) a conversion layer, provided on the top surface of the active-matrix substrates, for converting an electromagnetic wave into electrical charge; and

(III) a bias applying electrode layer provided on the conversion layer.

8. An electromagnetic wave capturing device, comprising:

(I) a composite active-matrix substrate which is provided with:

a plurality of active-matrix substrates, each having a top surface with an active element, which are disposed adjacent to one another so that the top surfaces of the active-matrix substrates make up a substantially level surface;

a base substrate, which is provided so as to oppose a bottom surface of the active-matrix substrates;

a gel sticking material as a first adhesive filler, which is provided to fill substantially a gap extending near a periphery of the active-matrix substrate between the bottom surface of each active-matrix substrate and the base substrate, for combining each active-matrix substrate with the base substrate; and

a second adhesive filler, which fills a gap between edges of the active-matrix substrates which are disposed adjacent to one another;

(II) a scintillator, provided on the top surface of the active-matrix substrates, for converting an electromagnetic wave into light; and

(III) a photo-electric conversion element, provided on the active-matrix substrates, for converting light into electrical charge.

Priority Claims (1)
JP 2001-140661 · May 10, 2001 · national
Continuity (2)
Division 1014320700 · May 10, 2002
Related Publication 20040211910A1 · Oct 28, 2004