Bump formation method and wire bonding method
Bump formation method and wire bonding method including a step of forming a ball on the tip end of a wire that passes through a capillary and joining this ball to an electrode pad so as to make a press-bonded ball. In the next step, the capillary is raised and moved horizontally so that the bottom flat portion of the capillary faces the press-bonded ball. Then, the capillary is lowered and the press-bonded ball is pressed, thus forming a first bump. Next, the capillary is raised and moved horizontally in a direction that is opposite from the previous horizontal-direction, thus positioning the flat portion of the capillary to face the first bump. Then, the capillary is lowered, and the wire is bent and pressed against the surface of the first bump so as to form a second bump. The wire is then cut from the second bump.
1. A bump formation method comprising a sequence of:
a first step that forms a ball on a tip end of a wire that passes through a capillary and joins said ball to a conductor to form a press-bonded ball;
a second step that raises and then moves said capillary in a horizontal direction to a first position so that a flat portion on a lower end of said capillary on a side of said capillary opposite to said horizontal-direction movement is positioned to face said press-bonded ball;
a third step that lowers said capillary so that said press-bonded ball is pressed by said flat portion of said capillary to form a first bump;
a fourth step that raises and moves said capillary in an opposite horizontal direction from said horizontal-direction movement of said capillary in said second step to a second position so that a flat portion on said lower end of said capillary on a side of said capillary opposite to said opposite horizontal-direction movement is positioned to face said first bump;
a fifth step that lowers said capillary so that said wire is bent and pressed against a surface of said first bump by said flat portion of said capillary, thus forming a second bump; and
a sixth step that cuts said wire from said second bump.
2. A bump formation method comprising a sequence of:
a first step that forms a ball on a tip end of a wire that passes through a capillary and joins said ball to a conductor to form a press-bonded ball;
a second step that raises and moves said capillary in a horizontal direction so that a flat portion on a lower end of said capillary is positioned to face said press-bonded ball;
a third step that lowers said capillary so that said press-bonded ball is pressed to form a first bump;
a fourth step that raises and lowers said capillary in an opposite horizontal direction from said horizontal-direction movement of said capillary in said second step so that said flat portion on said lower end of said capillary is positioned to face said first bump;
a fifth step that lowers said capillary so that said wire is bent and pressed against a surface of said first bump, thus forming a second bump; and
a sixth step that raises and moves said capillary in an opposite horizontal direction from said horizontal-direction movement in said fourth step so as to cause said flat portion on said lower end of said capillary to be positioned to face said second bump;
a seventh step that lowers said capillary so that said wire is bent and pressed against a surface of said second bump to form a third bump; and
an eighth step that cuts said wire from a uppermost bump.
3. A wire bonding method in which wire bonding between a first conductor aid second conductor is executed by performing primary bonding to a surface of a first conductor and then performing secondary bonding to a surface of a second conductor, said method comprising a sequence of:
a first step that forms a ball on a tip end of a wire that passes through a capillary and joins said ball to a conductor to form a press-bonded ball;
a second step that raises and then moves said capillary in a horizontal direction to a first position so that a flat portion on a lower end of said capillary on a side of said capillary opposite to said horizontal-direction movement is positioned to face said press-bonded ball;
a third step that lowers said capillary so that said press-bonded ball is pressed by said flat portion of said capillary to form a first bump;
a fourth step that raises and moves said capillary in an opposite horizontal direction from said horizontal-direction movement of said capillary in said second step to a second position so that said flat portion on said lower end of said capillary on a side of said capillary opposite to said opposite horizontal-direction movement is positioned to face said first bump;
a fifth step that lowers said capillary so that said wire is bent and pressed against a surface of said first bump by said flat portion of said capillary, thus forming a second bump with a direction of inclination of an inclined wedge oriented toward an opposite side from said first conductor; and
a sixth step that cuts said wire from said second bump, thus forming a two-stage bump; and then
said primary bonding is thereafter performed, after which said wire is looped from the said first conductor with respect to said bump, and said secondary bonding is performed on said inclined wedge on the upper portion of said bump.
4. A wire bonding method in which wire bonding between a first conductor and second conductor is executed by performing primary bonding to a surface of a first conductor and then performing secondary bonding to a surface of a second conductor, said method comprising a sequence of:
a first step that forms a ball on a tip end of a wire that passes through a capillary and joins said ball to a conductor to form a press-bonded ball;
a second step that raises and moves said capillary in a horizontal direction so that a flat portion on a lower end of said capillary is positioned to face said press-bonded ball;
a third step that lowers said capillary so that said press-bonded ball is pressed to form a first bump;
a fourth step that raises and lowers said capillary in an opposite horizontal direction from said horizontal-direction movement of said capillary in said second step so that said flat portion on said lower end of said capillary is positioned to face said first bump;
a fifth step that lowers said capillary so that said wire is bent and pressed against a surface of said first bump, thus forming a second bump; and
a sixth step that raises and moves said capillary in an opposite horizontal direction from said horizontal-direction movement of said capillary in said fourth step so as to cause said flat portion on said lower end of said capillary to be positioned to face said second bump;
a seventh step that lowers said capillary so that said wire is bent and pressed against a surface of said second bump to form a third bump; and
an eighth step that forms an inclined wedge on a final uppermost bump so that a direction of inclination of said inclined wedge is oriented toward an opposite side from said first conductor, said eighth step further cutting said wire from said final uppermost bump, thus forming a multi-stage bump; and then
said primary bonding is thereafter performed, after which said wire is looped from said first conductor with respect to said bump, and said secondary bonding is performed on said inclined wedge on the upper portion of said bump.