Stacked die package

1. A method for making a stacked die package, comprising:

mounting at least two chips on a first side of a flexible substrate;

forming solder balls on a second side of the substrate;

interconnecting the chips and the solder balls through the substrate;

stacking the chips to form the stacked die package;

surface mounting the stacked die package;

stiffening the substrate with a stiffener; and

cutting the stiffener away after folding the substrate to stack the chips.

2. The method of claim 1 , wherein the chips are surface mounted.

3. The method of claim 1 , wherein the chips are flip chips.

4. The method of claim 1 , wherein the substrate includes a sub panel format with multiple images of individual designs.

5. The method of claim 1 , wherein the flexible substrate is stiffened by a printed wiring board.

6. The method of claim 1 , wherein culling is performed with a single saw cut.

7. The method of claim 1 , wherein stacking the chips comprises:

folding the substrate to abut chips together top to top; and

adhering abutting chips to one another.

8. The method of claim 1 , and further comprising:

underfilling the flip chips after mounting and reflowing.

9. The method of claim 1 , wherein mounting comprises:

placing the substrate on a reflow boat;

laying out chips in a predetermined pattern; and

reflowing the chips to the substrate.

10. A method for forming a stacked die package, comprising:

stiffening a flexible substrate with a stiffener frame;

forming an array of mounting elements on a first side of the flexible substrate;

positioning the substrate mounting elements down on a reflow boat;

mounting and reflowing a plurality of chips on a second side of the flexible substrate in a predetermined pattern;

slacking the chips; and

removing the substrate stiffener.

11. The method of claim 10 , wherein removing the stiffener comprises:

sawing the stiffener away.

12. The method of claim 11 , wherein sawing is accomplished with a single saw cut.

13. The method of claim 10 , wherein stacking the chips comprises:

folding the substrate and stiffener in a predetermined pattern;

aligning chips to be stacked; and

adhering the stacked chips together.

14. The method of claim 13 , wherein adhering comprises:

applying an adhesive to the chips; and

folding the substrate to stack the chips.

15. The method of claim 10 , and further comprising:

underfilling the chips.

16. The method of claim 10 , wherein the stiffener is a printed wiring board frame disposed around a perimeter of the substrate.

17. The method of claim 10 , wherein the stiffener is a spacer.

18. The method of claim 10 , wherein the stiffener is a metal frame.

19. A method of forming a stacked die package, comprising:

stiffening a substrate with a stiffener;

forming solder balls on a back side of a substrate;

placing the substrate on a reflow boat with the back side facing down;

mounting at least two chips in a predetermined pattern on a front side of the substrate;

dispensing adhesive on a portion of the chips;

removing a portion of the stiffener;

folding the substrate and remaining stiffener to align the remaining portion of the chips with the portion of the chips having adhesive; and

curing the adhesive.

20. The method of claim 19 , and further comprising:

removing the remaining portion of the stiffener after curing.

21. The method of claim 20 , wherein removing the remaining portion of stiffener is accomplished with a single saw cut.

22. A method of making a stacked die package, comprising:

designing a substrate in sub panel format for folding to abut mounted chips top to top;

stiffening the substrate with a printed wiring board stiffener;

forming an array of solder balls on a side of the substrate;

mounting a plurality of chips on another side of the substrate in the sub panel arrangement;

folding the substrate to abut the mounted chips; and

removing the stiffener after adhering the chips top to top.