IP Library › Granted Patent US 7,056,189
Granted Patent B2
US 7,056,189 · App. 11/223,967 · Granted Jun 6, 2006

Grinding method of a workpiece and grinding apparatus

Assignee: Okamoto Machine Tool Works, Ltd.
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Quick Facts
Patent No.
US 7,056,189
App. No.
11/223,967
Granted
Jun 6, 2006
Kind
B2
Abstract

An adaptive work table-reciprocation control system and method that can reduce a grinding time. The system uses a vibration sensor head installed on a chuck surface in the vicinity of the workpiece to detect a vibration signal emitted from the contact zone between the grinding wheel and the workpiece. When the value of the vibration signals falls below a trigger level, a work table direction of motion is reversed.

Claims (34)

1. A method of grinding a workpiece surface of a workpiece using a rotable grinding wheel, where the workpiece is provided on a chuck on a work table and moved reciprocally in the horizontal direction, said method comprising:

detecting vibration signals emitted from a contact zone between the grinding wheel and the workpiece;

moving the work table in a moving direction when a value (E i ) of the vibration signal is higher than a previously set trigger value (E 0 ) of the vibration signal; and

transmitting a reverse signal to a drive unit of the work table to reverse a moving direction of the work table when the value (E i ) of the vibration signal reduces to a value equal to or below the previously set trigger value (E 0 ).

2. The method of claim 1 , further comprising moving the workpiece reciprocally relative to the grinding wheel.

3. The method of claim 1 , further comprising filtering the vibration signals with a low-pass filter.

4. The method of claim 3 , wherein the filtering prevents the transmitting of a reverse signal when the grinding wheel is above a gap in the workpiece.

5. The method of claim 4 , wherein the filtering blocks vibrations above a cutoff frequency from being detected and the cutoff frequency is between 5 and 500 Hz.

6. The method of claim 4 , wherein the width of the gap in the workpiece, measured in a direction of travel of the grinding wheel, is 0.01 to 10 mm.

7. The method of claim 1 , further comprising extracting a basic frequency from the vibration signal.

8. The method of claim 7 , wherein the basic frequency is between 1 and 100 Hz.

9. The method of claim 1 , wherein vibration signals are detected with a vibration sensor head installed on a surface of the chuck.

10. A grinding apparatus comprising:

a work table;

a chuck provided on the work table and configured to receive a workpiece;

a drive unit configured to reciprocate the work table in a first direction;

a grinding wheel spindle configured to move a grinding wheel in a second direction substantially perpendicular to a surface of the work table;

a vibration sensor head configured to detect a vibration signal generated from an interference area of the grinding wheel and the workpiece;

a comparison part configured to compare the value (E i ) of the vibration signal with the trigger value (E 0 ) of the vibration signal; and

an output part configured to output a signal to advance the work table in a first direction when the value (E i ) of the vibration signal at the basic frequency is higher than the trigger value (E 0 ) of the vibration signal at the basic frequency, and to output a reverse signal to the drive unit of the work table in a second direction when the value (E i ) of the vibration signal at the basic frequency reaches the trigger value (E 0 ) or less of the vibration signal at the basic frequency.

11. The grinding apparatus of claim 10 , further comprising a low-pass filter configured to receive the amplified vibration signal and to allow a specified frequency band to pass there-through.

12. The grinding apparatus of claim 11 , wherein the low-pass filter has a cut-off frequency between 5 and 500 Hz.

13. The grinding apparatus of claim 10 , further comprising a protective cover near the vibration sensor head.

14. The grinding apparatus of claim 10 , further comprising an amplifier configured to amplify the vibration signal detected by the vibration sensor head.

15. The grinding apparatus of claim 10 , further comprising a recording part configured to extract a basic frequency from the vibration signal having passed through the low-pass filter and to receive a value (E i ) of the vibration signal at the basic frequency.

16. The grinding apparatus of claim 10 , further comprising a storage part configured to store a trigger value (E 0 ) of the vibration signal at the basic frequency.

17. A grinding apparatus comprising:

a work table;

a chuck provided on the work table and configured to receive a workpiece;

a drive unit configured to reciprocate the work table in a first direction;

a grinding wheel spindle configured to move a grinding wheel in a second direction substantially perpendicular to a surface of the work table;

means for detecting vibration signals emitted from a contact zone between the grinding wheel and the workpiece;

means for determining, based on the vibration signals, whether the grinding wheel is grinding the workpiece.

18. The apparatus of claim 13 , wherein the means for determining includes a means for comparing the vibration signals to a preset vibration frequency.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2005
From: YUI, AKINORI; OKUYAMA, SHIGEKI; ISONO, JUNICHI
To: OKAMOTO MACHINE TOOL WORKS, LTD.
Reel/Frame 017241/0664 →
Priority Claims (1)
JP 2004-267675 · Sep 15, 2004 · national
Continuity (1)
Related Publication 20060057939A1 · Mar 16, 2006