Coaxial dual pin sockets for high speed I/O applications

1. A socket comprising:

a base;

a plurality of signal contacts disposed within the base; and

a grounding fence disposed within the base, the grounding fence laterally isolating signal contact pairs from one another to support differential signaling and laterally isolating individual contacts from one another to support single-ended signaling, the signaling to occur between a semiconductor package connected to the socket and a printed wiring board (PWB) connected to the socket.

2. The socket of claim 1 wherein the grounding fence includes:

a plurality of electrically conductive wall members; and

an interconnection structure coupled to one or more of the wall members, the interconnection structure enabling electrical contact between the grounding fence and a ground plane of the PWB;

said wall members having surfaces defining a plurality of contact apertures such that the contact apertures encompass the signal contacts.

3. The socket of claim 2 wherein each contact aperture encompasses at least one of the signal contacts such that the grounding fence supports single-ended signaling.

4. The socket of claim 2 wherein each contact aperture encompasses at least two of the signal contacts such that the grounding fence supports differential signaling.

5. The socket of claim 2 wherein the plurality of contact apertures includes:

a first set where each contact aperture in the first set encompasses at least one of the signal contacts; and

a second set where each contact aperture in the second set encompasses at least two of the signal contacts.

6. The socket of claim 2 wherein the interconnection structure includes a plurality of metal feet extending from a board side of the grounding fence.

7. The socket of claim 6 wherein the metal feet have a spacing that is less than a quarter wavelength of a predetermined operating frequency.

8. The socket of claim 2 , wherein the interconnection structure includes:

one or more ground contacts disposed within the base; and

a shorting mechanism coupled to the one or more ground contacts and at least one of the wall members.

9. The socket of claim 2 , wherein the interconnection structure includes:

a ground plane shunt; and

a shorting mechanism coupled to the ground plane shunt and at least one of the wall members.

10. The socket of claim 9 wherein the socket has an infinite signal pin to ground pin ratio.

11. The socket of claim 1 wherein the base includes surfaces defining a clearance aperture, the clearance aperture providing clearance space for capacitors coupled to an adjacent semiconductor package.

12. A socket comprising:

a base;

a plurality of signal contacts disposed within the base; and

a grounding fence disposed within the base, the grounding fence laterally isolating pairs of signal contacts from one another to support differential signaling and laterally isolating individual contacts from one another to support single-ended signaling, the signaling to occur between an adjacent semiconductor package and an adjacent printed wiring board (PWB);

wherein the grounding fence includes a plurality of electrically conductive wall members and an interconnection structure coupled to one or more of the wall members, the interconnection structure enabling electrical contact between the grounding fence and a ground plane of the PWB;

said wall members having surfaces defining a plurality of contact apertures such that the contact apertures encompass the signal contacts, and the interconnection structure including a plurality of metal feet extending from a board side of the grounding fence, the metal feet have a spacing that is less than a quarter wavelength of a predetermined operating frequency.

13. A socket comprising:

abase;

a plurality of signal contacts disposed within the base; and

at least one grounding fence disposed within the base, the at least one grounding fence laterally isolating signal contact pairs from one another to support differential signaling and laterally isolating individual contacts from one another to support single-ended signaling, the signaling to occur between a semiconductor package coupled to the socket and a board coupled to the socket.