IP Library Granted Patent US 7,064,357
Granted Patent B2
US 7,064,357 · App. 09/759,312 · Granted Jun 20, 2006

Nitride compound semiconductor light emitting device and method for producing the same

Assignee: Sharp Kabushiki Kaisha
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Quick Facts
Patent No.
US 7,064,357
App. No.
09/759,312
Granted
Jun 20, 2006
Kind
B2
Abstract

A nitride compound semiconductor light emitting device includes: a GaN substrate having a crystal orientation which is tilted away from a <0001> direction by an angle which is equal to or greater than about 0.05° and which is equal to or less than about 2°, and a semiconductor multilayer structure formed on the GaN substrate, wherein the semiconductor multilayer structure includes: an acceptor doping layer containing a nitride compound semiconductor; and an active layer including a light emitting region.

Claims (19)

1. A nitride compound semiconductor light emitting device comprising:

a GaN substrate having a (0001) plane whose crystal orientation is tilted away from a <0001> direction in a <11-20> or <1-100> direction by an angle which is equal to or greater than 0.05° and which is less than 2°, and

a n-type layer containing a nitride compound semiconductor located above the GaN substrate, and

an active layer containing a nitride compound semiconductor located above the GaN substrate, and

an acceptor doping layer containing a nitride compound semiconductor comprising Ga x In y Al 1−(x+y) N (where 0≦x≦1; 0≦y≦1; and 0≦x+y≦1) located above the GaN substrate,

wherein the GaN substrate and the active layer are formed so as to be apart from each other by a distance which is equal to or greater than about 1 μm.

2. A nitride compound semiconductor light emitting device according to claim 1 , wherein the acceptor doping layer exhibits a p-type conductivity as grown.

3. A nitride compound semiconductor light emitting device according to claim 1 , wherein the active layer has a quantum well structure, and the active layer has an averaged surface roughness which is equal to or less than a thickness of a well layer in the quantum well structure.

4. A nitride compound semiconductor light emitting device according to claim 1 , wherein the active layer includes at least one well layer and at least one barrier layer.

5. A nitride compound semiconductor light emitting device according to claim 1 , wherein said active layer is formed evenly with respect to a macroscopic view and a microscopic view relating to an order of thickness of the active layer.

6. A nitride compound semiconductor light emitting device according to claim 1 , wherein said acceptor doping layer is formed evenly with respect to a macroscopic view and a microscopic view relating to an order of thickness of the active layer.

7. A nitride compound semiconductor light emitting device comprising:

a GaN substrate having a (0001) plane whose crystal orientation is tilted away from a <0001> direction in a <11-20> or <1-100> direction by an angle which is equal to or greater than 0.05° and which is less than 2°, and

a n-type layer containing a nitride compound semiconductor located above the GaN substrate, and

an active layer containing a nitride compound semiconductor located above the GaN substrate, and

an acceptor doping layer containing a nitride compound semiconductor comprising Ga x In y Al 1−(x+y) N (where 0≦x≦1; 0≦y≦1; and 0≦x+y≦1) located above the GaN substrate, wherein the acceptor doping layer exhibits a p-type conductivity as grown.

8. A nitride compound semiconductor light emitting device according to claim 7 , wherein the GaN substrate and the active layer are formed so as to be apart from each other by a distance which is equal to or greater than about 1 μm.

9. A nitride compound semiconductor light emitting device according to claim 8 , wherein the active layer has a quantum well structure, and the active layer has an averaged surface roughness which is equal to or less than a thickness of a well layer in the quantum well structure.

10. A nitride compound semiconductor light emitting device according to claim 7 , wherein the acceptor doping layer has a hole density of 10 17 cm −3 or more.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2001
From: UETA, YOSHIHIRO; YUASA, TAKAYUKI; OGAWA, ATSUSHI; TSUDA, YUHZOH; ARAKI, MASAHIRO
To: SHARP KABUSHIKI KAISHA
Reel/Frame 011861/0883 →
Priority Claims (1)
JP 2000-005385 · Jan 14, 2000 · national
Continuity (1)
Related Publication 20010030329A1 · Oct 18, 2001