Semiconductor device having memory and logic devices with reduced resistance and leakage current
A semiconductor technique is provided which can achieve both of lowered resistance in a logic formation region and reduced leakage current of the capacitor of a memory device. Source/drain regions ( 4 ) are formed in the upper surface of a semiconductor substrate ( 1 ) in a memory formation region and cobalt silicide films ( 9 ) are formed in the upper surfaces of the source/drain regions ( 4 ). Source/drain regions ( 54 ) are formed in the upper surface of the semiconductor substrate ( 1 ) in a logic formation region and cobalt silicide films ( 59 ) are formed in the upper surfaces of the source/drain regions ( 54 ). The cobalt silicide films ( 59 ) in the logic formation region are thicker than the cobalt silicide films ( 9 ) in the memory formation region.
1. A semiconductor device comprising:
a semiconductor substrate having a memory formation region in which a memory device is formed and a logic formation region in which a logic device is formed;
a first impurity region formed in an upper surface of said semiconductor substrate in said memory formation region;
a second impurity region formed in the upper surface of said semiconductor substrate in said logic formation region;
a third impurity region formed in an upper surface of said first impurity region and having a conductivity type different from that of said first impurity region;
a fourth impurity region formed in an upper surface of said second impurity region and having a conductivity type different from that of said second impurity region;
a first silicide film formed in an upper surface of said third impurity region;
a capacitor formed above said first silicide film and electrically connected to said first silicide film; and
a second silicide film formed in an upper surface of said fourth impurity region and having a larger thickness than said first silicide film.
2. The semiconductor device according to claim 1 , further comprising,
first and second gate structures formed on the upper surface of said semiconductor substrate in said memory formation region and spaced apart at a given distance from each other, and
third and fourth gate structures formed on the upper surface of said semiconductor substrate in said logic formation region and spaced apart at a given distance from each other,
wherein said first and second silicide films are provided between said first and second gate structures and between said third and fourth gate structures, respectively, and
a first gate aspect ratio that is defined by the distance between said first and second gate structures and a height of said first and second gate structures is larger than a second gate aspect ratio that is defined by the distance between said third and fourth gate structures and a height of said third and fourth gate structures.
3. The semiconductor device according to claim 2 , wherein said first gate aspect ratio is larger than 0.8.
4. The semiconductor device according to claim 1 , further comprising,
a fifth impurity region formed in the upper surface of said semiconductor substrate in said logic formation region,
a sixth impurity region formed in an upper surface of said fifth impurity region and having a conductivity type different from that of said fifth impurity region, and
a third silicide film formed in an upper surface of said sixth impurity region and thinner than said second silicide film.
5. The semiconductor device according to claim 4 , wherein each of said third, fourth and sixth impurity regions is a source/drain region of a MOS transistor.
6. The semiconductor device according to claim 4 , further comprising,
first and second gate structures formed on the upper surface of said semiconductor substrate in said memory formation region and spaced apart at a given distance from each other,
third and fourth gate structures formed on the upper surface of said semiconductor substrate in said logic formation region and spaced apart at a given distance from each other, and
fifth and sixth gate structures formed on the upper surface of said semiconductor substrate in said logic formation region and spaced apart at a given distance from each other,
wherein said first to third silicide films are provided between said first and second gate structures, between said third and fourth gate structures, and between said fifth and sixth gate structures, respectively, and
a first gate aspect ratio that is defined by the distance between said first and second gate structures and a height of said first and second gate structures and a third gate aspect ratio that is defined by the distance between said fifth and sixth gate structures and a height of said fifth and sixth gate structures are both larger than a second gate aspect ratio that is defined by the distance between said third and fourth gate structures and a height of said third and fourth gate structures.
7. The semiconductor device according to claim 6 , wherein said first and third gate aspect ratios are each larger than 0.8.
8. The semiconductor device according to claim 6 , further comprising:
an interlayer insulating film formed over said semiconductor substrate and covering said first to sixth gate structures;
a first contact plug provided in and through said interlayer insulating film and connected to said third silicide film;
an insulating layer provided on said interlayer insulating film; and
a second contact plug provided in and through said insulating layer and connected to said first contact plug,
wherein said capacitor is provided in said insulating layer.