Microelectronic substrates with integrated devices
A microelectronic substrate including at least one microelectronic device disposed within an opening in a microelectronic substrate core, wherein an encapsulation material is disposed within portions of the opening not occupied by the microelectronic devices, or a plurality microelectronic devices encapsulated without the microelectronic substrate core. At least one conductive via extended through the substrate, which allows electrical communication between opposing sides of the substrate. Interconnection layers of dielectric materials and conductive traces are then fabricated on the microelectronic device, the encapsulation material, and the microelectronic substrate core (if present) to form the microelectronic substrate.
1. A microelectronic substrate, comprising:
a first microelectronic substrate core having a first surface and an opposing second surface, said first microelectronic substrate core having at least one opening defined therein extending from said first microelectronic substrate core first surface to said first microelectronic substrate core second surface;
at least one first microelectronic device disposed within said at least one opening, said at least one first microelectronic device having an active surface and a back surface, wherein said first microelectronic device active surface is adjacent said first microelectronic substrate core first surface;
a first encapsulation material adhering said first microelectronic substrate core to said at least one first microelectronic device forming a first surface adjacent said microelectronic die active surface and said core first surface and a second surface adjacent said microelectronic die back surface and said core second surface;
a second microelectronic substrate core having a first surface and an opposing second surface, said second microelectronic substrate core having at least one opening defined therein extending from said second microelectronic substrate core first surface to said second microelectronic substrate core second surface;
at least one second microelectronic device disposed within said at least one opening, said at least one second microelectronic device having an active surface and a back surface, wherein said second microelectronic device active surface is adjacent said second microelectronic substrate core first surface;
a second encapsulation material adhering said second microelectronic substrate core to said at least one second microelectronic device forming a first surface adjacent said microelectronic die active surface and said core first surface and a second surface adjacent said microelectronic die back surface and said core second surface; and
said first microelectronic device active surface oriented to face said second microelectronic device active surface.
2. The microelectronic substrate of claim 1 , further including a first interconnection layer disposed proximate said first microelectronic substrate core first surface, said first encapsulation first surface, and said first microelectronic device active surface and further including a second interconnection layer disposed proximate said second microelectronic substrate core first surface, said second encapsulation material first surface, and said first microelectronic device active surface, wherein said first and second interconnection layers are electrically connected.
3. The microelectronic substrate of claim 1 , further including an interconnection layer disposed proximate at least one of said first microelectronic substrate core second surface, said first encapsulation material second surface, and said first microelectronic device back surface, and said second microelectronic substrate core second surface, said second encapsulation material second surface, and said second microelectronic device back surface.
4. The microelectronic substrate of claim 1 , further including at least one conductive via extending from said first microelectronic substrate core first surface and said first microelectronic substrate core second surface.
5. The microelectronic substrate of claim 1 , further including at least one conductive via extending between said second microelectronic substrate core first surface and said second microelectronic substrate core second surface.
6. The microelectronic substrate of claim 1 , further including at least one conductive via extending from said first microelectronic substrate core second surface and said second microelectronic substrate core second surface.
7. The microelectronic substrate of claim 1 , further including at least one heat dissipation device thermally attached to at least one of said at least one first microelectronic device back surface and said at least one second microelectronic device back surface.
8. A microelectronic substrate, comprising:
a first microelectronic substrate core having a first surface and an opposing second surface, said first microelectronic substrate core having at least one cavity defined therein;
at least one first microelectronic device disposed within said at least one cavity, said at least one first microelectronic device having an active surface and a back surface, wherein said first microelectronic device active surface is adjacent said first microelectronic substrate core first surface;
a first encapsulation material adhering said first microelectronic substrate core to said at least one first microelectronic device forming a first surface adjacent said microelectronic die active surface;
a second microelectronic substrate core having a first surface and an opposing second surface, said second microelectronic substrate core having at least one cavity defined therein;
at least one second microelectronic device disposed within said at least one cavity, said at least one second microelectronic device having an active surface and a back surface, wherein said second microelectronic device active surface is adjacent said second microelectronic substrate core first surface;
a second encapsulation material adhering said second microelectronic substrate core to said at least one second microelectronic device forming a first surface adjacent said microelectronic die active surface and said core first surface; and
said first microelectronic device active surface oriented to face said second microelectronic device active surface.
9. The microelectronic substrate of claim 8 , further including a first interconnection layer disposed proximate said first microelectronic substrate core first surface, said first encapsulation first surface, and said first microelectronic device active surface and further including a second interconnection layer disposed proximate said second microelectronic substrate core first surface, said second encapsulation material first surface, and said first microelectronic device active surface, wherein said first and second interconnection layers are electrically connected.