IP Library › Granted Patent US 7,090,423
Granted Patent B2
US 7,090,423 · App. 10/248,771 · Granted Aug 15, 2006

Connecting structures

Assignee: Sumitomo Electric Industries, Ltd.
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Quick Facts
Patent No.
US 7,090,423
App. No.
10/248,771
Granted
Aug 15, 2006
Kind
B2
Abstract

Joint formations that, in joining together joining members employed in a variety of electrical and electronic components, yield sufficiently high joint strength in the direction perpendicular to the plane in which two joining members join, and meanwhile in the direction parallel to the joint plane. First and second joining members have respective joint phases each formed with a different number of distinct yet continuous conformational faces, defining the joint phases so that neither is the matching complement of the other. A bonding agent interposed between the joint phases joins the joining members together. The difference in thermal expansion coefficient between the two joining members, and between them and the bonding agent, is 5.0×10 −6 /° C. or less. The joining members are a metal such as tungsten or Cu—W, or a ceramic such as AlN or Si 3 N 4 ; and glass or a solder material is utilized for the bonding agent.

Claims (20)

1. A susceptor-component joint formation, being a structure in which two joining members employed in a susceptor component are joined to each other, the joint formation comprising:

a first joining member having a joint conformation formed with at least two distinct yet continuous surface features that are integral with said first joining member, and a second joining member having a joint conformation formed with at least three distinct yet continuous surface features that are integral with said second joining member, said first joining-member joint conformation and said second joining-member joint conformation each being defined so that neither conformation is the complete topographical opposite of the other; and

a bonding agent interposed between the joint conformations to join said two joining members together.

2. The susceptor-component joint formation as set forth in claim 1 , wherein said two joining members differ from each other, and said joining members differ from said bonding agent, by 5.0×10 −6 /° C. or less in coefficient of thermal expansion.

3. The susceptor-component joint formation as set forth in claim 1 , wherein said bonding agent is glass or a metal brazing material.

4. The susceptor-component joint formation as set forth in claim 2 , wherein said bonding agent is glass or a metal brazing material.

5. The susceptor-component joint formation as set forth in claim 1 , wherein said two joining members are a metal-metal, metal-ceramic, or ceramic-ceramic combination.

6. The susceptor-component joint formation as set forth in claim 2 , wherein said two joining members are a metal-metal, metal-ceramic, or ceramic-ceramic combination.

7. The susceptor-component joint formation as set forth in claim 3 , wherein said two joining members are a metal-metal, metal-ceramic, or ceramic-ceramic combination.

8. The susceptor-component joint formation as set forth in claim 5 , wherein said metal is nickel, tungsten, molybdenum, copper, copper-tungsten, or copper-molybdenum.

9. The susceptor-component joint formation as set forth in claim 6 , wherein said metal is nickel, tungsten, molybdenum, copper, copper-tungsten, or copper-molybdenum.

10. The susceptor-component joint formation as set forth in claim 7 , wherein said metal is nickel, tungsten, molybdenum, copper, copper-tungsten, or copper-molybdenum.

11. The susceptor-component joint formation as set forth in claim 5 , wherein said ceramic is aluminum nitride, silicon nitride, silicon carbide, or aluminum oxide.

12. The susceptor-component joint formation as set forth in claim 6 , wherein said ceramic is aluminum nitride, silicon nitride, silicon carbide, or aluminum oxide.

13. The susceptor-component joint formation as set forth in claim 7 , wherein said ceramic is aluminum nitride, silicon nitride, silicon carbide, or aluminum oxide.

14. The susceptor-component joint formation as set forth in claim 1 , wherein one of either said two joining members is aluminum nitride.

15. The susceptor-component joint formation as set forth in claim 2 , wherein one of either said two joining members is aluminum nitride.

16. The susceptor-component joint formation as set forth in claim 5 , wherein one of either said two joining members is aluminum nitride.

17. The susceptor-component joint formation as set forth in claim 6 , wherein one of either said two joining members is aluminum nitride.

18. The susceptor-component joint formation as set forth in claim 7 , wherein one of either said two joining members is aluminum nitride.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2003
From: NATSUHARA, MASUHIRO; NAKATA, HIROHIKO; KUIBIRA, AKIRA
To: SUMITOMO ELECTRIC INDUSTRIES, LTD.
Reel/Frame 013428/0686 →
Priority Claims (1)
JP 2002-044477 · Feb 21, 2002 · national
Continuity (1)
Related Publication 20030221854A1 · Dec 4, 2003