IP Library › Granted Patent US 7,091,803
Granted Patent B2
US 7,091,803 · App. 10/942,611 · Granted Aug 15, 2006

Signal transmission structure

Assignee: VIA Technologies, Inc.
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Quick Facts
Patent No.
US 7,091,803
App. No.
10/942,611
Granted
Aug 15, 2006
Kind
B2
Abstract

A signal transmission structure is disclosed. The signal transmission structure is adapted for a circuit substrate, including at least a signal line, a plating bar and a reference plane. The plating bar is disposed on a side of the reference plane and connected to the signal line. In addition, the plating bar is disposed on the side of the reference plane, and the reference plane has a non-reference area corresponding to the plating bar. The signal transmission structure can reduce the impedance mismatch at the conjunction of the signal line and the plating bar, and the resonant frequency of the plating bar can be improved as to generate a desired transmission quality of the signal.

Claims (20)

1. A signal transmission structure, adapted for a circuit substrate, comprising:

a reference plane, having a non-reference region;

a signal line, disposed on a side of the reference plane;

a plating bar, disposed on a side of the reference plane, wherein the plating bar is coupled to the signal line and the non-reference region corresponds to the plating bar; and

a via through the reference plane, wherein the signal line and the plating bar on different sides are connected through the via.

2. The signal transmission structure of claim 1 , wherein the signal line and the plating bar are on the same side of the reference plane.

3. The signal transmission structure of claim 1 , wherein the non-reference region completely corresponds to the plating bar.

4. The signal transmission structure of claim 1 , wherein the reference plane has at least one opening, and the non-reference region is composed of the opening.

5. The signal transmission structure of claim 1 , wherein the reference plane is a power plane or a ground plane.

6. The signal transmission structure of claim 1 , wherein the non-reference region locally corresponds to the plating bar.

7. The signal transmission structure of claim 6 , wherein the non-reference region locally corresponds to a conjunction of the plating bar and the signal line.

8. The signal transmission structure of claim 6 , wherein the non-reference region does not correspond to a conjunction of the plating bar and the signal line.

9. A signal transmission structure, adapted for a circuit substrate, comprising:

at least one signal line;

a plating bar, wherein an end of the plating bar is connected to the signal line;

a ground plane disposed on a side same as that of the signal line and the plating bar, the ground plane having an opening corresponding to the plating bar; and

a via passing through the ground plane, wherein the via connects with the signal line.

10. The signal transmission structure of claim 9 , wherein a length of the opening is equal to a length of the plating bar.

11. The signal transmission structure of claim 9 , wherein a length of the opening is shorter than that of the plating bar.

12. The signal transmission structure of claim 9 , wherein the opening surrounds the via.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 15, 2004
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 015809/0794 →
Priority Claims (1)
TW 92131758 A · Nov 13, 2003 · national
Continuity (1)
Related Publication 20050104692A1 · May 19, 2005