Semiconductor device and method of manufacturing thereof
View Patent ↗To provide a liquid crystal display device having high quality display by obtaining a high aperture ratio while securing a sufficient storage capacitor (Cs), and at the same time, by dispersing a load (a pixel writing-in electric current) of a capacitor wiring in a timely manner to effectively reduce the load. A scanning line is formed on a different layer from a gate electrode and the capacitor wiring is arranged so as to be parallel with a signal line. Each pixel is connected to the individually independent capacitor wiring via a dielectric. Therefore, variations in the electric potential of the capacitor wiring caused by a writing-in electric current of a neighboring pixel can be avoided, whereby obtaining satisfactory display images.
1. A method of manufacturing a semiconductor device comprising:
forming a first wiring on a substrate having an insulating surface;
forming a first insulating film on the first wiring;
forming a semiconductor film on the first wiring;
forming a second insulating film on the semiconductor film;
forming a first contact hole reaching the first wiring by selectively etching the first insulating film and the second insulating film;
forming a gate electrode on the second insulating film, wherein the gate electrode is electrically connected to the first wiring through the first contact hole;
forming a third insulating film on the gate electrode;
forming a second contact hole reaching the semiconductor film by selectively etching the second insulating film and the third insulating film; and
forming a third wiring on the third insulating film, wherein the third wiring is electrically connected to the semiconductor film through the second contact hole.
2. A method of manufacturing a semiconductor device according to claim 1 , wherein the first wiring comprises a scanning line.
3. A method of manufacturing a semiconductor device according to claim 1 , wherein the third wiring comprises a signal line.
4. A method of manufacturing a semiconductor device according to claim 1 , wherein the second insulating film comprises a gate insulating film.
5. A method of manufacturing a semiconductor device according to claim 1 , wherein the gate electrode comprises at least one element selected from the group consisting of Si, W, Al, Ta, Cr, and Mo.
6. A method of manufacturing a semiconductor device according to claim 1 , wherein the semiconductor device is an EL display device.
7. A method of manufacturing a semiconductor device according to claim 1 , wherein the semiconductor device is one selected from the group consisting of a video camera, a digital camera, a projector, a head-mount display, car navigation system, a personal computer, a mobile computer, a player using a recording medium, and an information processing terminal.
8. A method of manufacturing a semiconductor device comprising:
forming a first wiring on a substrate having an insulating surface;
forming a first insulating film on the first wiring;
forming a semiconductor film on the first wiring;
forming a second insulating film on the semiconductor film;
forming a first contact hole reaching the first wiring by selectively etching the first insulating film and the second insulating film;
forming a gate electrode and a second wiring on the second insulating film, wherein the gate electrode is electrically connected to the first wiring through the first contact hole;
forming a third insulating film on the gate electrode;
forming a second contact hole reaching the semiconductor film by selectively etching the second insulating film and the third insulating film; and
forming a third wiring on the third insulating film, wherein the third wiring is electrically connected to the semiconductor film through the second contact hole.
9. A method of manufacturing a semiconductor device according to claim 8 , wherein the first wiring comprises a scanning line.
10. A method of manufacturing a semiconductor device according to claim 8 , wherein the second wiring comprises a capacitor wiring.
11. A method of manufacturing a semiconductor device according to claim 8 , wherein the third wiring comprises a signal line.
12. A method of manufacturing a semiconductor device according to claim 8 , wherein the second insulating film comprises a gate insulating film.
13. A method of manufacturing a semiconductor device according to claim 8 , wherein the gate electrode comprises at least one element selected from the group consisting of Si, W, Al, Ta, Cr, and Mo.
14. A method of manufacturing a semiconductor device according to claim 8 , wherein the semiconductor device is an EL display device.
15. A method of manufacturing a semiconductor device according to claim 8 , wherein the semiconductor device is one selected from the group consisting of a video camera, a digital camera, a projector, a head-mount display, car navigation system, a personal computer, a mobile computer, a player using a recording medium, and an information processing terminal.
16. A method of manufacturing a semiconductor device comprising:
forming a first wiring on a substrate having an insulating surface;
forming a first insulating film on the first wiring;
forming a semiconductor film on the first wiring;
forming a second insulating film on the semiconductor film;
forming a first contact hole reaching the first wiring by selectively etching the first insulating film and the second insulating film;
forming a gate electrode and a second wiring on the second insulating film, wherein the gate electrode is electrically connected to the first wiring through the first contact hole;
forming a third insulating film on the gate electrode;
forming a second contact hole reaching the semiconductor film by selectively etching the second insulating film and the third insulating film; and
forming a third wiring on the third insulating film, wherein the third wiring is electrically connected to the semiconductor film through the second contact hole, and wherein the third wiring is formed in parallel with the second wiring.
17. A method of manufacturing a semiconductor device according to claim 16 , wherein the first wiring comprises a scanning line.
18. A method of manufacturing a semiconductor device according to claim 16 , wherein the second wiring comprises a capacitor wiring.
19. A method of manufacturing a semiconductor device according to claim 16 , wherein the third wiring comprises a signal line.
20. A method of manufacturing a semiconductor device according to claim 16 , wherein the second insulating film comprises a gate insulating film.
21. A method of manufacturing a semiconductor device according to claim 16 , wherein the gate electrode comprises at least one element selected from the group consisting of Si, W, Al, Ta, Cr, and Mo.
22. A method of manufacturing a semiconductor device according to claim 16 , wherein the semiconductor device is an EL display device.
23. A method of manufacturing a semiconductor device according to claim 16 , wherein the semiconductor device is one selected from the group consisting of a video camera, a digital camera, a projector, a head-mount display, car navigation system, a personal computer, a mobile computer, a player using a recording medium, and an information processing terminal.
24. A method of manufacturing a semiconductor device comprising:
forming a first wiring on a substrate having an insulating surface;
forming a first insulating film on the first wiring;
forming a semiconductor film on the first wiring;
forming a second insulating film on the semiconductor film;
forming a first contact hole reaching the first wiring by selectively etching the first insulating film and the second insulating film;
forming a gate electrode on the second insulating film, wherein the gate electrode is electrically connected to the first wiring in each pixel through the first contact hole;
forming a third insulating film on the gate electrode;
forming a second contact hole reaching the semiconductor film by selectively etching the second insulating film and the third insulating film; and
forming a third wiring on the third insulating film, wherein the third wiring is electrically connected to the semiconductor film through the second contact hole.
25. A method of manufacturing a semiconductor device according to claim 24 , wherein the first wiring comprises a scanning line.
26. A method of manufacturing a semiconductor device according to claim 24 , wherein the third wiring comprises a signal line.
27. A method of manufacturing a semiconductor device according to claim 24 , wherein the second insulating film comprises a gate insulating film.
28. A method of manufacturing a semiconductor device according to claim 24 , wherein the gate electrode comprises at least one element selected from the group consisting of Si, W, Al, Ta, Cr, and Mo.
29. A method of manufacturing a semiconductor device according to claim 24 , wherein the semiconductor device is an EL display device.
30. A method of manufacturing a semiconductor device according to claim 24 , wherein the semiconductor device is one selected from the group consisting of a video camera, a digital camera, a projector, a head-mount display, car navigation system, a personal computer, a mobile computer, a player using a recording medium, and an information processing terminal.
31. A method of manufacturing a semiconductor device comprising:
forming a first wiring on a substrate having an insulating surface;
forming a first insulating film on the first wiring;
forming a semiconductor film on the first wiring;
forming a second insulating film on the semiconductor film;
forming a first contact hole reaching the first wiring by selectively etching the first insulating film and the second insulating film;
forming a gate electrode and a second wiring on the second insulating film, wherein the gate electrode is electrically connected to the first wiring in each pixel through the first contact hole;
forming a third insulating film on the gate electrode;
forming a second contact hole reaching the semiconductor film by selectively etching the second insulating film and the third insulating film; and
forming a third wiring on the third insulating film, wherein the third wiring is electrically connected to the semiconductor film through the second contact hole.
32. A method of manufacturing a semiconductor device according to claim 31 , wherein the first wiring comprises a scanning line.
33. A method of manufacturing a semiconductor device according to claim 31 , wherein the second wiring comprises a capacitor wiring.
34. A method of manufacturing a semiconductor device according to claim 31 , wherein the third wiring comprises a signal line.
35. A method of manufacturing a semiconductor device according to claim 31 , wherein the second insulating film comprises a gate insulating film.
36. A method of manufacturing a semiconductor device according to claim 31 , wherein the gate electrode comprises at least one element selected from the group consisting of Si, W, Al, Ta, Cr, and Mo.
37. A method of manufacturing a semiconductor device according to claim 31 , wherein the semiconductor device is an EL display device.
38. A method of manufacturing a semiconductor device according to claim 31 , wherein the semiconductor device is one selected from the group consisting of a video camera, a digital camera, a projector, a head-mount display, car navigation system, a personal computer, a mobile computer, a player using a recording medium, and an information processing terminal.