Load lock chamber having two dual slot regions
Provided herein is a substrate processing system, which comprises a cassette load station; a load lock chamber; a centrally located transfer chamber; and one or more process chambers located about the periphery of the transfer chamber. The load lock chamber comprises double dual slot load locks constructed at same location. Such system may be used for processing substrates for semiconductor manufacturing.
1. A substrate processing system, comprising:
a cassette load station;
a transfer chamber;
a load lock chamber located between the cassette load station and the transfer chamber, the load lock chamber having a substrate temperature regulating device movably disposed therein, wherein the load lock chamber comprises upper and lower isolated load lock regions that share a common wall, the upper and lower isolated load lock regions each comprising a sealable opening to the cassette load station and a sealable opening to the transfer chamber, the upper and lower isolated load lock regions each comprising at least two substrate storage slots; and
one or more process chambers located about the periphery of the transfer chamber, each of the one or more process chambers comprising an opening to the transfer chamber.
2. The substrate processing system of claim 1 , wherein the temperature regulating device comprises a heating plate.
3. The substrate processing system of claim 1 , wherein the temperature regulating device comprises a cooling plate.
4. The substrate processing system of claim 1 , further comprising
a robot diposed in the transfer chamber for moving substrates between the load lock chamber and the transfer chamber.
5. The substrate processing system of claim 4 , wherein the robot is vertically movable.
6. A substrate processing system, comprising:
a cassette load station;
a transfer chamber;
a load lock chamber located between the cassette load station and the transfer chamber, the load lock chamber having a substrate temperature regulating device movably disposed therein, wherein the load lock chamber comprises upper and lower isolated load lock regions, wherein each of the upper and lower isolated load lock regions comprises a cooling plate and two substrate storage slots, the upper and lower isolated load lock regions each comprising an opening to the cassette load station and an opening to the transfer chamber; and
one or more process chambers located about the periphery of the transfer chamber, each of the one or more process chambers comprising an opening to the transfer chamber.
7. The substrate processing system of the claim 6 , further comprising a robot disposed in the transfer chamber for moving substrates between the load lock chamber and the transfer chamber.
8. The substrate processing system of claim 7 , wherein the robot is vertically movable.
9. The substrate processing system of claim 6 , further comprising a flip type door between the cassette load station and the load lock chamber.
10. The substrate processing system of claim 6 , further comprising a flip type slit valve between the load lock chamber and the transfer chamber.
11. The substrate processing system of claim 10 , wherein the valve is operated below a substrate transferring plane.
12. A substrate processing system, comprising:
a cassette load station;
a transfer chamber;
a load lock chamber located between the cassette load station and the transfer chamber, wherein the load lock chamber comprises upper and lower isolated load lock regions each having two substrate storage slots, a heating plate in each isolated load lock region, wherein at least one of the heating plate or coolin plate is moveable, the upper and lower isolated load lock regions each comprising an opening to the cassette load station and an opening to the transfer chamber; and
one or more process chambers located about the periphery of the transfer chamber, each of the one or more process chambers comprising an opening to the transfer chamber.
13. The substrate processing system of claim 12 , wherein the upper and lower isolated load lock regions share a common wall.
14. The substrate processing system of claim 12 , further comprising a vertically movable robot disposed in the transfer chamber for moving substrates between the load lock chamber and the transfer chamber.
15. The substrate processing system of claim 12 , further comprising a flip type door between the load lock chamber and the transfer chamber.
16. The substrate processing system of claim 12 , further comprising a flip type slit valve between the load lock chamber and the transfer chamber.
17. The substrate processing system of claim 16 , wherein the valve is operated below a substrate transferring plane.
18. A substrate processing system, comprising:
a transfer chamber;
a load lock chamber located between the cassette load station and the transfer chamber, the load lock chamber having a substrate temperature regulating movably device disposed therein, wherein the load lock chamber comprises upper and lower isolated load lock regions that share a common wall, the upper and lower isolated load lock regions each comprising two substrate storage slots, a sealable opening to a cassette load station and a sealable opening to the transfer chamber; and
one or more process chambers located about the periphery of the transfer chamber, each of the one or more process chambers comprising an opening to the transfer chamber.
19. The substrate processing system of claim 18 , wherein the substrate temperature regulating device is a heating plate.
20. The substrate processing system of claim 18 , wherein the substrate temperature regulating device is a cooling plate.
21. The substrate processing system of claim 18 , further comprising a robot disposed in the transfer chamber for moving substrates between the load lock chamber and the transfer chamber.
22. The substrate processing system of claim 21 , wherein the robot is vertically movable.
23. A substrate processing system, comprising:
a transfer chamber;
a load lock chamber located between the cassette load station and the transfer chamber, the load lock chamber having a substrate temperature regulating device movably disposed therein, wherein the load lock chamber comprises upper and lower isolated load lock regions, wherein each of the upper and lower isolated load lock regions comprises a cooling plate and two substrate storage slots, the upper and lower isolated load lock regions each comprising an opening to a cassette load station and an opening to the transfer chamber; and
one or more process chambers located about the periphery of the transfer chamber, each of the one or more process chambers comprising an opening to the transfer chamber.
24. The substrate processing system of claim 23 , further comprising a robot disposed in the transfer chamber for moving substrates between the load lock chamber and the transfer chamber.
25. The substrate processing system of claim 24 , wherein the robot is vertically movable.