Electron microscopy system and electron microscopy method

1. An electron microscopy system for inspecting an object positionable in an object plane of the electron microscopy system, the system comprising:

an electron source for generating a primary electron beam;

primary electron optics having an objective lens for focusing the primary electron beam to form a primary electron beam spot which is substantially a point spot in the object plane, and a controllable first beam deflector for deflecting the primary electron beam relative to the objective lens for scanning the primary electron beam spot across the object plane;

an electron detector for detecting an electron intensity, wherein the electron detector is a two-dimensionally position-sensitive detector;

secondary electron optics including the objective lens, for transferring secondary electrons emanating from the object plane in a region around the primary electron beam spot as a secondary electron beam to the electron detector, and

a controller for receiving signals from the electron detector and for allocating the received signals to a position in an image based upon a location of the primary electron beam spot in the object plane.

2. The electron microscopy system according to claim 1 , further comprising a beam splitter disposed in the primary electron optics between the electron source and the objective lens and in the secondary electron optics between the objective lens and the electron detector.

3. The electron microscopy system according to claim 2 , wherein the secondary electron optics further comprises an energy filter disposed in the beam path of the secondary electron beam between the objective lens and the electron detector.

4. The electron microscopy system according to claim 1 , wherein the secondary electron optics is configured such that the object plane is imaged substantially sharply on the electron detector.

5. The electron microscopy system according to claim 1 , wherein the secondary electron optics is configured such that a diffraction plane conjugated to the object plane in the secondary electron optics is imaged substantially sharply on the electron detector.

6. The electron microscopy system according to claim 5 , wherein the secondary electron optics is switchable between a first mode setting for imaging the object plane substantially sharply on the electron detector, and a second mode setting for imaging the diffraction plane substantially sharply on the electron detector.

7. The electron microscopy system according to claim 6 , further comprising a controller for energizing at least one further imaging lens of the secondary electron optics in dependence of the first and second mode settings.

8. The electron microscopy system according to claim 1 , wherein a diameter of the primary electron beam spot is less than 500 nm.

9. An electron microscopy system for inspecting an object positionable in an object plane of the electron microscopy system, the system comprising:

an electron source for generating a primary electron beam;

primary electron optics for providing a primary electron beam path from the electron source to the object plane, the primary electron optics including a beam splitter, an objective lens downstream of the beam splitter in the primary electron beam path, for focusing the primary electron beam to form a primary electron beam spot in the object plane, and a first beam deflector downstream of the beam splitter in the primary electron beam path, for deflecting the primary electron beam relative to the objective lens;

an electron detector for detecting an electron intensity, wherein the electron detector includes an array of detector pixels;

secondary electron optics for providing a secondary electron beam path from the object plane to the detector, the secondary electron optics including the objective lens, the first beam deflector, the beam splitter downstream of the objective lens and the first beam deflector in the secondary electron beam path, and a second beam deflector downstream of the beam splitter in the secondary electron beam path; and

a controller for controlling the first beam deflector for adjusting a deflection of the primary electron beam relative to the objective lens, and for controlling the second beam deflector in dependence on the deflection of the primary electron beam.

10. A scanning-electron-microscopy-type apparatus providing a primary electron beam path and a secondary electron beam path, comprising:

an electron source;

a beam splitter, an objective lens, and a first beam deflector, each disposed in the primary electron beam path and in the secondary electron beam path;

a second beam deflector and an electron detector, each disposed in the secondary electron beam path and outside the primary electron beam path; and

a controller for operating the second beam deflector in dependence on a deflection provided by the first beam deflector.

11. A method for inspecting an object to obtain structure information of the object, the method comprising:

generating a primary electron beam spot on the object by directing a finely focused primary electron beam onto the object;

scanning the primary electron beam spot relative to the object;

obtaining a secondary electron image with a two-dimensionally position-sensitive detector; and

obtaining the structure information from the secondary electron image, the structure information corresponding to a location of the scanned primary electron beam spot at a given time.

12. The method according to claim 11 , wherein the analyzed image is an image of an object plane at which the object is positioned.

13. The method according to claim 11 , wherein the analyzed image is an image of a diffraction plane conjugate to the object plane at which the object is positioned.

14. The method according to claim 11 , further including obtaining image information of the secondary electron image from only a subset of a plurality of pixels of a position sensitive electron detector.

15. A method for inspecting an object, the method comprising:

generating a primary electron beam spot on the object by directing a primary electron beam onto the object through an objective lens;

deflecting the primary electron beam relative to the objective lens;

separating from the primary electron beam a secondary electron beam emanating from the primary electron beam spot;

deflecting the separated secondary electron beam relative to the detector in dependence on a deflection of the primary electron beam; and

detecting an intensity of the separated secondary electron beam with a detector.

16. The method according to claim 15 , wherein the deflection of the secondary electron beam compensates for a deterioration of the detected intensities caused by the deflection of the primary electron beam.

17. A scanning-electron-microscopy-type apparatus, comprising:

a source of primary electrons;

a beam splitter, an objective lens, and a first beam deflector, each disposed to receive the primary electrons and to receive secondary electrons emanating from an object impinged by the primary electrons;

a second beam deflector and an electron detector, each disposed to receive the secondary electrons and not to receive the primary electrons; and

a controller for operating the second beam deflector in dependence on a deflection of the primary electrons provided by the first beam deflector.

18. A method for inspecting an object, the method comprising:

generating primary electrons and directing the primary electrons onto an object through an objective lens;

deflecting the primary electrons relative to the objective lens with a first beam deflector;

separating from the primary electrons secondary electrons emanating from the object impinged by the primary electrons

deflecting the separated secondary electrons relative to the detector with a second beam deflector in dependence on a deflection of the primary electrons; and

detecting an intensity of the separated secondary electrons.