IP Library › Granted Patent US 7,106,046
Granted Patent B2
US 7,106,046 · App. 10/518,396 · Granted Sep 12, 2006

Current measuring method and current measuring device

Assignee: Asahi Kasei EMD Corporation
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Quick Facts
Patent No.
US 7,106,046
App. No.
10/518,396
Granted
Sep 12, 2006
Kind
B2
Abstract

A current measuring method capable of reducing the size of a current sensor while ensuring electric insulation easily and suitable for enhancing reliability by preventing heat generation. A current measuring device comprises a printed board ( 3 ) having a conductor for measurement ( 4 ), and a noncontact current sensor ( 100 ) being mounted on the printed board ( 3 ), wherein the current sensor ( 100 ) is mounted on the surface ( 92 ) of the printed board ( 3 ) opposite to the side provided with the conductor for measurement ( 4 ). Since the current sensor ( 100 ) is mounted on the rear surface ( 92 ), electric insulation between the secondary conductor of the current sensor ( 100 ) and the conductor for measurement ( 4 ) can be ensured relatively easy.

Claims (20)

1. A current measuring method comprising mounting a current sensor on a board having a conductor for measurement and measuring a current flowing through said conductor for measurement, wherein said current sensor is mounted on a surface of said board on the side that is opposite to the side provided with said conductor for measurement, said current sensor has a Hall element that detects magnetic fields and magnetic flux concentrating means that causes a magnetic flux to be concentrated in a predetermined direction, and said magnetic flux concentrating means is provided in such a manner that a magnetic flux generated by a current flowing through said conductor for measurement is concentrated on a magnetic flux sensing surface of said Hall element.

2. The current measuring method according to claim 1 , wherein said current sensor is mounted on a surface of said board on the side that is opposite to the side provided with said conductor for measurement and in a position symmetrical to said conductor for measurement with respect to said board.

3. The current measuring method according to either claim 1 or claim 2 , wherein a soft magnetic material is provided on an exterior surface of said conductor for measurement on the side that is opposite to an exterior surface facing the surface of said board.

4. The current measuring method according to either claim 1 or claim 2 , wherein a soft magnetic material is provided on an exterior surface of said current sensor on the side that is opposite to an exterior surface facing the surface of said board.

5. The current measuring method according to either claim 1 or claim 2 , wherein between said current sensor and said board, there are provided multiple soft magnetic materials so as to be parallel to the direction of a current flowing through said conductor for measurement.

6. The current measuring method according to claim 1 , wherein said current sensor integrally incorporates said Hall element and said magnetic flux concentrating means and said magnetic flux concentrating means is provided between said Hall element and said facing surface.

7. The current measuring method according to claim 6 , wherein said magnetic flux concentrating means comprises multiple magnetic flux concentrating plates and is provided in such a manner that when said current sensor is mounted, surfaces of said magnetic flux concentrating plates are facing the surface of said board.

8. The current measuring method according to claim 7 , wherein said multiple magnetic flux concentrating plates are spaced in such a manner that when said current sensor is mounted, surfaces of said magnetic flux concentrating plates are opposite to the surface of said board and said multiple magnetic flux concentrating plates are positioned on both sides of a centerline of said conductor for measurement as viewed from the direction perpendicular to the plane of said board.

9. The current measuring method according to claim 1 , wherein said conductor for measurement is a printed wiring and said board is a printed board.

10. A current measuring device, comprising a board having a conductor for measurement and a current sensor mounted on the surface of said board, that measures a current flowing through said conductor for measurement, wherein said current sensor is mounted on the surface of said board on the side that is opposite to the side provided with said conductor for measurement, said current sensor has a Hall element that detects magnetic fields and magnetic flux concentrating means that concentrates a magnetic flux in a predetermined direction, and said magnetic flux concentrating means is provided in such a manner that a magnetic flux generated by a current flowing through said conductor for measurement is concentrated on a magnetic flux sensing surface of said Hall element.

11. The current measuring device according to claim 10 , wherein said current sensor is mounted on the surface of said board on the side that is opposite to the side provided with said conductor for measurement and in a position symmetrical to said conductor for measurement with respect to said board.

12. The current measuring device according to either claim 10 or claim 11 , wherein a soft magnetic material is provided on an exterior surface of said conductor for measurement on the side that is opposite to the side of an exterior surface facing the surface of said board.

13. The current measuring device according to either claim 10 or claim 11 , wherein a soft magnetic material is provided on an exterior surface of said current sensor on the side that is opposite to an exterior surface facing the surface of said board.

14. The current measuring device according to either claim 10 or claim 11 , wherein between said current sensor and said board, there are provided multiple soft magnetic materials so as to be parallel to the direction of a current flowing through said conductor for measurement.

15. The current measuring device according to either claim 10 or claim 11 , wherein said current sensor integrally incorporates said Hall element and said magnetic flux concentrating means and said magnetic flux concentrating means is provided between said Hall element and said facing surface.

16. The current measuring device according to claim 15 , wherein said magnetic flux concentrating means comprises multiple magnetic flux concentrating plates and is provided in such a manner that when said current sensor is mounted, surfaces of said magnetic flux concentrating plates are facing the surface of said board.

17. The current measuring device according to claim 16 , wherein said multiple magnetic flux concentrating plates are spaced in such a manner that when said current sensor is mounted, surfaces of said magnetic flux concentrating plates are opposite to the surface of said board and said multiple magnetic flux concentrating plates are positioned on both sides of a centerline of said conductor for measurement as viewed from the direction perpendicular to the plane of said board.

18. The current measuring device according to claim 10 , wherein said board has multiple conductors to be measured and said current sensor is mounted in a position where the distance of said board from each of said conductors to be measured is in a predetermined relation.

19. The current measuring device according to claim 10 , wherein said conductor for measurement is a printed wiring and said board is a printed board.

20. The current measuring device according to claim 10 , wherein a magnetic flux sensing part of said Hall element is formed from Si, GaAs, InAs or InSb.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2004
From: NAGANO, SHUICHI; SHIBAHARA, KOJI; ISHIBASHI, KAZUTOSHI
To: ASAHI KASEI EMD CORPORATION
Reel/Frame 017193/0153 →
Priority Claims (1)
JP 2002-177681 · Jun 18, 2002 · national
Continuity (1)
Related Publication 20060033487A1 · Feb 16, 2006