IP Library Granted Patent US 7,115,697
Granted Patent B2
US 7,115,697 · App. 10/930,545 · Granted Oct 3, 2006

Adhesive for high-temperature laminate

Assignee: E. I. du Pont de Nemours and Company
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Quick Facts
Patent No.
US 7,115,697
App. No.
10/930,545
Granted
Oct 3, 2006
Kind
B2
Abstract

An adhesive composition comprising a two-component system comprising A) at least one polyester urethane containing at least two isocyanate groups, which polyester urethane may be obtained by reaction of one or more polyesters 1 with aliphatic diisocyanates and reaction with one or more polyesters 2, wherein polyester 1 exhibits a number average molecular weight Mn in the range from 3,000 to 7,000 g/mol and polyester 2 exhibits a number average molecular weight Mn in the range from 700 to 2,000 g/mol and B) one or more branched polyesters with a number average molecular weight Mn in the range from 1,000 to 3,500 g/mol and optionally one or more conventional additives; the present invention provides a polyurethane-based adhesive composition which is suitable for the production of laminates for sterilizable packaging and exhibits a low residual content of highly volatile diisocyanates. The adhesive according to the invention ensures that no or only slight delamination of the film composites occurs even at elevated temperatures.

Claims (16)

1. An adhesive composition comprising a two-component system comprising

A) at least one polyester urethane containing at least two isocyanate groups, which polyester urethane being obtained by reaction of one or more polyesters 1 with aliphatic diisocyanates and reaction with one or more polyesters 2, wherein polyester 1 has a number average molecular weight Mn in the range from 3,000 to 7,000 g/mol and polyester 2 has a number average molecular weight Mn in the range from 700 to 2,000 g/mol and

B) one or more branched polyesters with a number average molecular weight Mn in the range from 1,000 to 3,500 g/mol.

2. The adhesive composition according to claim 1 wherein the polyesters 1 and 2 of component A) and the polyesters of component B) are hydroxy-functional polyesters.

3. The adhesive composition according to claim 1 wherein the equivalent ratio by weight of the isocyanate (NCO) groups of the polyester urethane of component A) to the hydroxy (OH)-functional groups of the polyester of component B) is from 1:0.5 to 1:2.

4. The adhesive composition according to claim 3 wherein the equivalent ratio by weight of the isocyanate (NCO) groups of the polyester urethane of component A) to the hydroxy (OH)-functional groups of the polyester of component B) is from 1:0.9.

5. The adhesive composition according to claim 1 wherein the polyesters 1 and 2 of component A) are unbranched polyesters.

6. The adhesive composition according to claim 1 wherein the OH to NCO ratio in the polyester urethane of component A) is s from 1:2 to 1:4.

7. The adhesive composition according to claim 1 wherein polyester 1 is produced from components selected from the group consisting of adipic acid, isophthalic acid, azelaic acid, ethylene glycol, diethylene glycol and hexanediol-1,6.

8. The adhesive composition according to claim 1 wherein polyester 2 is produced from the components selected from the group consisting of adipic acid, isophthalic acid, terephthalic acid, dimethylterephthalat, azelaic acid, ethylene glycol, diethylene glycol, hexanediol-1,6, propylene glycol.

9. The adhesive composition according to claim 1 wherein the polyester of component B) is produced from the components selected from the group consisting of adipic acid, isophthalic acid, ethylene glycol, propylene glycol and trimethylolpropane.

10. A process for bonding substrates for producing heat-sealing laminates comprising the steps

a) applying an adhesive composition according to claim 1 onto the surface of at least one of the substrates to be bonded and

b) curing the composition.

11. A process according to claim 10 wherein the substrates are web-form materials selected from the group consisting of polyethylene, polypropylene, polyamide, metal foils, plastics films, metal oxide vapour-deposited plastics films and metal vapour-deposited plastics films.

12. A bonded substrate for producing a heat-sealing laminate bonded with the adhesive composition of claim 1 .

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2008
From: BOSTIK GMBH
To: BOSTIK SA
Reel/Frame 021328/0725 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2007
From: E.I. DU PONT DE NEMOURS AND COMPANY
To: BOSTIK GMBH
Reel/Frame 020134/0707 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2004
From: KLEINEBERG, OLAF; DE JONG, ERIK; TEMELTAS, ENGIN; PFEIFFER, HEINZ-PETER; SCHREIBER, PETER
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 015427/0283 →
Continuity (1)
Related Publication 20060046067A1 · Mar 2, 2006